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Name |
Yang-Hsien Lee |
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Title |
Associate Professor |
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Office |
K204-1 |
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Phone |
886-6-2533131 Ext. 3529 |
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Email |
yslee@stust.edu.tw
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Webpage |
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Education |
Ph D., National Cheng Kung University |
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Research Interests |
Manufacturing Process, soldering Technology,
Microstructure and Mechanical Property Analysis of
Materials |
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Laboratory |
Lead-free
Composite Solder and Mechanical Property Lab.
(K511) |
Projects
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Year |
Project
Title |
Budget |
Period |
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2007 |
The evaluation of novel composite lead-free solder and
characterized for mechanical properties |
665,000 |
2007/08/01-2008/07/31 |
Publications
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Journal
Papers |
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H.
T. Lee, Y.
H. Lee, “Effects
of
in-Situ Nickel Particle Addition on the Microstructure
and Microhardness of Sn-Ag Solder,” Science and
Technology of Welding and Joining, Vol. 10, No. 3,
2005, pp. 353-360.
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H.
T. Lee, Y.
H. Lee ,”Adhesive
strength
and tensile fracture on Ni particle enhanced Sn-Ag
composite solder joints,” Materials Science and
Engineering A419, 2006, pp.172-180.
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Y.
H. Lee, H.
T. Lee, “
Shear strength
and interfacial microstructure of Sn-Ag-xNi / Cu
single shear lap solder joints,”
Materials Science and Engineering A 444, 2007, pp.
75-83.
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Yang-Hsien
Lee,
The
effects of
Microstructure
and Microhardness after Nickel Particle Added to the
of Sn-Ag Solder,
Journal of Southern Taiwan University of Technology,
No.28, pp.191-200,
Dec.
2003.
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Yang-Hsien
Lee,
The effects of
Adhesive
strength of Sn-Ag-xNi/Cu substrate solder joints,
Journal of Southern Taiwan University of Technology,
No.30, pp.69-76,
Dec.
2005.
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Conference
Papers |
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S.Y. Hu,
H.T.
Lee, Y.H. Lee,L.W. Son, Interface microstructure of
Sn-Ag-Sb lead-free solder with Au/Ni-P/Cu substrate,，2003
Conference of Chinese Materials Science, Taiwan,
2003/11.
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M,H
Chen, H.T. Lee,
Y.H Lee, B.W Chen, Influence of cooling rate to
Sn-3.5Ag solder micro-structure and mechanical
properties, the 20th national scientific seminar of
Chinese Society of Mechanical Engineers, d volume, the
first part pp101-104, 2003/12,
University
of Taiwan.
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Y,T Xu,
Influence of microstructure and mechanical properties
of added Ni to Sn-Ag-Sb solder, the 22nd scientific
seminar
of Chinese Society of Mechanical Engineers, 2005/11,
D1-002-1-6, Central University,
Taiwan.
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Y.F.
Chen, H.T. Lee,
S,R Chen, , Y.H. Lee, The influence of microstructure
and microhardness to added Cu to Sn-Ag-Sb solder, 22nd
national scientific seminar of Chinese Society of
Mechanical Engineers, 2005/11
D1-101,Central Universities, Taiwan.
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Y.H.
Lee, H.T Lee,
Y.F. Chen, W.Y Huang, S.R Chen, Adhesive strength of
Sn-Ag-xNi /Cu solder joint, 22nd national scientific
seminar of Chinese Society of Mechanical Engineers
D1-045-1, 2005/11,
Central Universities, Taiwan
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Y. T Xu,
Influence
of Sn-Ag/Cu solder joint IMC morphology after added Ni
to solder, society's 2006 annual meeting of Chinese's
Material Science, P03-156, 2006/11,NCKU,
Tainan , Taiwan.
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H.T Lee,
Y.F. Chen,
F.F. Lee, Adhesive strength of Cu enhanced of
intensity to Sn-Ag-Sb lead-free solder, Taiwan Welding
Society, A120-125,Tainan, STUT, Oct. 2007.
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Y.H.
Lee, W.Y Huang,
S.Y Lin，
Microstructure and adhesive strength of Sn-Ag-xNi
lead- free composite solder joints，Taiwan
Welding Society, A126-130,Tainan, STUT, Oct. 2007.
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Professional Certificates
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Technician certificate of
Class B in CNC lathe, Taiwan, 1996.
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Safety
and health
technician
of industrial and mining, Higher Examination,
Examination institute, 1980.
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Fire-fighting
equipment
technician,
Higher Examination,
Examination institute,
1999.
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