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Name
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Wen-Yeong Huang
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Title
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Associate
Professor
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Office
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K204-1
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Phone
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886-6-2533131 Ext.
3529
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Email
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wyhuang@stust.edu.tw
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Webpage
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Education
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PhD, National
Cheng Kung University
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Research Interests
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Lead-free solder,
Mechanical Drawing, PLC controller, Microstructure Analysis of Materials,
Mechanical Property Analysis of Materials,
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Laboratory
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PLC Lab. (K503)
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Publications
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Journal Papers
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1.
Wen-Yeong Huang, 2007, “The Effects of Aging and Strain Rate on
mechanical property of Sn-Ag-Sb-Cu Solder joints”, Journal of Southern
Taiwan University, vol. 32 pp.111-118.
2. H. T. Lee, W. Y. Huang, and Y. F. Chen, 2007, “Influence of Cu Addition
on Intermetallic Compound Formation and Microstructure of
Sn-3wt%Ag-1.5wt%Sb-xCu Solder Joints”, Accepted, Science
and Technology of Welding and Joining
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Conference Papers
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1. H. T. Lee, W.
Y. Huang, Y. S. Lee, Y. F. Chen and F. F. Lee, “The Effects of Cu Addition
on Microstructure and Tensile Strength of Sn-Ag-Sb Lead-Free Solder” Taiwan Welding Society, Tainan, Southern
Taiwan University, Oct. 2007, pp. A120-A125
2. Y.
S. Lee, W. Y. Huang and Y. S. Lin, “The Effects of Microstructure on
Tensile Fracture Formation of Sn-Ag-xNi Lead-Free Composited Solder Joints”
Taiwan Welding Society, Tainan, Southern
Taiwan University, Oct. 2007, pp. A126-A130
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