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1. K. J. Chen, “Rechargeable all-solid-state tin ion battery in
a low-temperature environment”, Results in
Materials 10 (2021) 100190.
2. K. J. Chen, Y. H. Fang, F. Y. Hung, “Novel
photovoltaic ribbon technology: interfacial behavior of IN-50Sn alloy
ribbon without metal matrix under electrothermal effects and chlorine
corrosion”, Mater. Today Commun. 26 (2021) 101865.
3.
K. J. Chen, F. Y. Hung, T. S. Lui, C. L. Tsai, “Improving the applicability of
wear-resistant Al–10Si–0.5Mg alloy obtained through selective laser melting
with T6 treatment in high-temperature, and high-wear environments”, J.
Mater. Res. Tech. 9 (4) (2020) 9242-9252.
4.
K. J. Chen, “Novel
Application Research on Critical High-Temperature Deformation of Low-Lead
Brass Alloy”, Metals 10 (2020) 722.
5.
K. J. Chen, F. Y. Hung, C. Y. Chang, “A study of the Sulfidation Behavior
on Palladium-Coated Copper Wire with a Flash-Gold Layer (PCA) after Wire
Bonding”, Electronics 8 (2019) 792.
6.
K. J. Chen, F. Y. Hung, T. S. Lui, Y. R. Shih, “Wear inducing phase
transformation of plasma transfer arc coated tools during friction stir
welding with Al alloy”, J. of Eng.
2019 (2019) 6413608.
7.
K. J. Chen, F. Y. Hung, T. S. Lui, W. Y. Lin, “Effects of Static Heat and
Dynamic Current on Al/Zn･Cu/Sn Solder/Ag Interfaces of Sn
Photovoltaic Al-Ribbon Modules”, Materials
11 (2018) 1642.
8.
K. J. Chen, F. Y. Hung, T. S. Lui, L. Hsu, “Studies of Interfacial
Microstructures and Series Resistance on Electroplated and Hot-Dipped
Sn-xCu Photovoltaic Modules”, J.
Electron. Mater. 47 (10) (2018) 6028-6035.
9.
K. J. Chen, F.
Y. Hung, T. S. Lui, C. H. Tseng, “Effects of
tempered microstructure and hydrogen concentration on hydrogen-induced
embrittlement susceptibility of 10B21 screws at low temperature”, Mater. Trans. 59 (2018) 1124-1129.
10.
K. J. Chen, F.
Y. Hung, T. S. Lui, C. H. Tseng, “Decrease in
Hydrogen Embrittelemnt susceptibility of 10B21 Screws by Bake Aging.”,
Metals 6 (2016) 211.
11.
K. J. Chen, F.
Y. Hung, T. S. Lui, L. H. Chen, Y. W. Chen, “A study of green Sn-xZn photovoltaic ribbons for solar cell
application”, Solar Energ. Mater. Solar Cells 143 (2015) pp. 561-566.
12.
K. J. Chen, F.
Y. Hung, T. S. Lui, L. H. Chen, Y. W. Chen, “Characterizations of Cu/Sn-Zn Solder/Ag Interfaces on
Photovoltaic Ribbon for Silicon Solar Cell”, IEEE J. Photovoltaic 5 (1)
(2015) 202-205.
13.
K. J. Chen, F.
Y. Hung, T. S. Lui, L. H. Chen, D. W. Qiu, T. L. Chou, “Microstructure and electrical mechanism of Sn-xAg-Cu
PV-ribbon for solar cells”, Microelectron. Eng. 116 (2014) pp. 33-39.
14.
K. J.Chen, F. Y. Hung, T. S. Lui, R. S. Xiao, “Improvement of
Charge-Discharge characteristics of the Mg-Ni powder electrode at 55 °C”,
J. of Nanomaterial. 2013 (2013) 638953.
15.
K. J. Chen, F.
Y. Hung, T. S. Lui, L. H. Chen, D. W. Qiu, T. L. Chou, “Effects of Electrical Current on Microstructure and Interface
Properties of SnAgCu/Ag Photovoltaic Ribbons”, Materials Transactions, Vol. 54, No. 7 (2013), pp.1155-1159.
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