|
©m¦W¡GÀ¹¤l³ó |
¾ºÙ¡G°Æ±Ð±Â
ݺë±K¾÷±ñ¬ãµo¤¤¤ß¥D¥ô |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¹q¸Ü¤À¾÷¡G3559 |
¿ì¤½«Ç¡GK405-2 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
E-Mail¡Gtytai@stust.edu.tw |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¹êÅç«Ç¡GK502 ¥ý¶i»s³y¹êÅç«Ç¡BF102
ºë±Kű³y¹êÅç«Ç¡BK107 ºë±K¾÷±ñ¦@¦P¹êÅç«Ç |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
³Ì°ª¾Ç¾ú¡G°ê¥ß¦¨¥\¤j¾Ç¾÷±ñ¤uµ{³Õ¤h |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¬ã¨s»â°ì¡G¥ý¶i¥[¤u»Pºë±K»s³y¡B§÷®Æ·L¤§µ²ºc¤ÀªR»P¾÷±ñ©Ê½è´ú¸Õ¡B¥é¥Í¬ì¾Ç |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¾Ç³NºaÅA |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
1. »OÆW¾÷±ñ¤u·~¦P·~¤½·|2014¾÷±ñ¤u·~²£¾Ç°^Äm¼ú 2. ¼w°êC®³¤j¾Ç(Friedrich-Schiller Universitaet Jena) ³X°Ý¾ÇªÌ (2008.07-2008.08) 3. °ê¬ì·|¦¨¤j¶Q«»ö¾¹¨Ï¥Î¤¤¤ß FE-SEM §U±Ð
(2003.03-2004.01) 4. Àò±o¦æ¬F°|°ê®a¬ì¾Ç©eû·|¸É§U¥x¤é³Õ¤h¥Í´»´Á¬ã¨spµe (Summer Program) ¼ú¾Çª÷¡Au¤é¥»ªF¨Ê¤j¾Ç¥Í²£§Þ³N¬ã¨s©Ò¶i× (2003.09-2003.10) 5.
Àò±o¼w°ê¾Ç³N¥æ¬yÁ`¸p(DAAD)©M°ê¬ì·|(NSC)¦@¦P¦X§@ªº¤T©úªvpµe(Sandwich
Program)¼ú¾Çª÷¡Au¼w°êªü¦ë¤u·~¤j¾Ç(RWTH Aachen)¶i× (2001.09-2003.02) |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Àò¼ú |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¡@´Á¥Z½×¤å |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
1.
T.Y. Tai, K. T. Nguyen,
2016, ¡§The Grain Size Effect of Polycrystalline Diamond on Surface Integrity
by Using Micro EDM¡¨, Procedia CIRP, Vol. 42, pp.305-310. 2.
F. C. Hsu, T. Y. Tai,
Van Nhan Vo, S. Y. Chen, Y. H. Chen, 2013, ¡§The machining characteristics of
polycrystalline diamond (PCD) by Micro-WEDM¡¨, Procedia CIRP, Vol. 6,
pp.262-267. 3.
T. Y. Tai, S. J. Lu, Y.
H. Chen, 2011, ¡§Surface crack susceptibility of electrodischarge machined
steel surfaces¡¨, International Journal of Advanced Manufacturing Technology,
Vol. 57, Issue 9, pp. 983~989. (SCI,EI) 4.
H. T. Lee, T. Y. Tai, C.
Liu, F. C. Hsu, J. M. Hsu, 2011, ¡§Effect of Material Physical Properties on
Residual Stress Measurement by EDM Hole-Drilling Method¡¨, Journal of
Engineering Materials and Technology, Vol.113, No.2, pp. 021014-1~021014-8.
(SCI, EI) 5.
S. H. Kang, T. Y. Tai,
T. H. Fang, 2010, ¡§Replication of bionic butterfly wing microstructures using
soft lithography¡¨, Current Applied Physics, Vol. 10, No. 2, pp. 625-630.
2010.(SCI, EI) 6.
T. Y. Tai, S. J. Lu,
2009, ¡§Improving the Fatigue Life of Electro-Discharge Machined SKD11 Tool
Steel Via the Suppression of Surface Cracks¡¨, International Journal of
Fatigue, Vol. 31, No.3, pp. 433-438. (SCI, EI) 7.
T. Y. Tai, T. Masusawa
and H. T. Lee, 2007, ¡§Drilling Microholes in Hot Tool Steel by Using
Micro-Electro Discharge Machining¡¨, Materials Transactions, Vol. 48, No. 2,
pp. 205-210. ( SCI, EI) 8.
H. T. Lee, J. Mayer, F.
C. Hsu, W. P. Rehbach, T. Weirich, A. Dimyati, T. Y. Tai, 2006, ¡¨ Application
of EDM Hole-Drilling to the Measurement of Residual Stress in Tool and Carbon
Steels¡¨, Journal of Engineering Materials and Technology, Vol. 3, No. 128,
pp. 468-475. (SCI, EI) 9.
H. T. Lee, W. P.
Rehbach, T. Y. Tai, F. C. Hsu, 2004, ¡§Relationship
between Electrode Size and Surface Cracking in the EDM Machining Process¡¨,
Journal of Materials Science, Vol. 39, No.23, pp. 6981-6986. (SCI, EI) 10.
H. T. Lee, W. P.
Rehbach, F. C. Hsu, T. Y. Tai, Edward Hsu, 2004, ¡§The Study of EDM
Hole-Drilling Method for Measuring Residual Stress in SKD11 Tool Steel¡¨,
Journal of Material Processing Technology, Vol.149, pp. 88-93. (SCI, EI) 11.
H. T. Lee, F.C. Hsu, T.
Y. Tai, 2004, ¡§Study of surface integrity using the small area EDM process
with a copper-tungsten electrode¡¨, Material Science and Engineering A, Vol.
364, pp. 346-356. (SCI, EI) 12.
H. T. Lee, W. P.
Rehbach, T. Y. Tai, F. C. Hsu, 2003, ¡§Surface Integrity in Micro- Hole
Drilling Using Micro-Electro Discharge Machining¡¨, Materials Transaction,
Vol. 44, No. 12, pp. 2718-2722. (SCI, EI) 13. H. T. Lee and T. Y. Tai, 2003, ¡§Relationship between EDM
Parameters and Surface Crack Formation¡¨, Journal of Material Processing
Technology, Vol. 142, No. 3, pp. 676-683. (SCI, EI) |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¡@¬ã°Q·|½×¤å |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
1.
Tzu-Yao Tai, Nian-Hua
Feng, 2018, ¡§An experimental investigation into the electro-discharge
machining of SKD11 tool steel using composite copper-molybdenum electrodes¡¨,
IEEE International Conference on Applied System Innovation 2018, Tokyo,
Japan. 2. ¶¾¥@´a¡BÀ¹¤l³ó¡B´¿«T®Ë, 2017, ¡§À³¥Î˶ǻ¼ªk©ó¥Û¾¥¹q·¥¤§©ñ¹q¥[¤uªí¼h¯S©Ê¹w´ú¡¨, ²Ä¤T¤Q¥|©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¤¤, »OÆW. 3. ¶ÀµÏ³¡BÀ¹¤l³ó¡B§fÂ@, 2017, ¡§¥H¥Ð¤fªk©MÃþ¯«¸gºô¸ô±´°Q¥Û¾¥©M¬õ»É¹q·¥¹ïSKD11§N§@¤u¨ã¿û©ñ¹q¥[¤u¤§µ²ªG¡¨, ²Ä¤T¤Q¥|©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¤¤, »OÆW. 4. Jun Lyu,Tzu-Yao Tai,and Shun-Wei
Huang, 2017, ¡§THE EFFECTS OF GRAPHITE AND COPPER ELECTRODE ON EDMED SURFACE
OF SKD11 COLD TOOL STEEL BY USING TAGUCHI METHOD¡¨, 2017 INTERNATIONAL
SYMPOSIUM ON NOVEL AND SUSTAINABLE TECHNOLOGY, Tainan, Taiwan. 5. J.Y. Zeng, T.Y.
Tai, and S.H. Feng, 2017, ¡§The prediction of surface integrity on EDMed surface with graphite electrode by using back
propagation method¡¨, 2017 INTERNATIONAL SYMPOSIUM ON NOVEL AND SUSTAINABLE
TECHNOLOGY, Tainan, Taiwan. 6. Tzu-Yao Tai,
Hung-Chang Chen, 2017, ¡§The Effect of Adding Nickel Powder into the
Dielectric Fluid by Using Micro EDM Process¡¨, Materials, Methods &
Technologies, BULGARIA 7. H.Z. Chen, T.
Y. Tai, and Y.H. Wang, 2016, ¡§Stationary Bike with Continuously Variable Tramission of Resistance¡¨, 2016 International Symposium
on Novel and Sustanable Technology, Tainan, Taiwan. 8. S.H. Feng, T.Y.
Tai, and G.Y. Chen, 2016, ¡§The Influence of Recast Layer on Tool Steel under
Different Step during EDM Process¡¨, 2016 International Symposium on Novel and
Sustanable Technology, Tainan, Taiwan. 9. T. Y. Tai, S.
W. Huang, and G. Y. Chen, 2016, ¡§The influence of EDM Electrode Wear of
Different Working Step during EDM Process¡¨, 2016 International Symposium on
Novel and Sustanable Technology, Tainan, Taiwan. 10. T. Y. Tai, Y.
H. Wang, 2016, ¡§Development of self-adjusting resistance by rotating speed to
physical fitness equipment for elderly in neighborhood
parks¡¨, 21st Annual Congress of the European College of Sport Science,
Vienna, Austria. 11. T. Y. Tai, K.
T. Nguyen, 2016, ¡§The Grain Size Effect of Polycrystalline Diamond on Surface
Integrity by Using Micro EDM¡¨, 18th CIRP Conference on Electro Physical and
Chemical Machining (ISEM XVIII), Tokyo, Japan. 12. À¹¤l³ó¡BĬ¨|¾§¡B³\´I»Í¡B³¯Pºû, 2015, ¡§·L²Ó½u©ñ¹q¥[¤u¹ïV·¾¾¦¶Zºë«×¤§±´°Q¡¨, ²Ä¤T¤Q¤G©¡¾÷±ñ¤uµ{¬ã°Q·|, °ª¶¯, »OÆW. 13. À¹¤l³ó¡B¤ý§²[¡B¼B±j¡B³¢¥¿¦t, 2015, ¡§¥i½Õªý¤O¦¡²GÀ£¤WªÏÅé¾A¯à¾¹§÷«Ø¸m¬ãµo¡¨, ²Ä¤T¤Q¤G©¡¾÷±ñ¤uµ{¬ã°Q·|, °ª¶¯, »OÆW. 14. À¹¤l³ó¡BÁ©s§»¡B³\´I»Í¡B³¯¤¨»Î¡B³¯¬f¦w, 2015, ¡§¶}µo½u¤Á³Î²Ä¤»¶b¥ß¦¡±ÛÂà©w¦ì¥¥x¹ï304L¤£Äÿû·L¤Ä¨¤¥[¤u¤§¬ã¨s¡¨, ²Ä¤T¤Q¤G©¡¾÷±ñ¤uµ{¬ã°Q·|, °ª¶¯, »OÆW. 15. K. T. Nguyen,T. Y. Tai, 2015, ¡§Micro Hole Drilling on PCD by
Micro EDM Technology¡¨, 2015 International Symposium on Nano Science and
Technology, Tainan, Taiwan. 16. K. T. Nguyen,
T. Y. Tai, K. Y. Chen, 2015, ¡§The Influence of PCD Grain Size on Machining
Characteristics¡¨, 2015 International Symposium on Nano Science and
Technology, Tainan, Taiwan. 17. T. Y. Tai, C.
Liu, C. Y. Kuo, 2015, ¡§Development of adjustable
resistance mechanism to physical fitness equipment for elderly in neighborhood parks¡¨, 20th Annual Congress of European
College of Sport Science, Malmoe, Sweden. 18. À¹¤l³ó¡B³¯¨Èºû¡B³¯«a¦t¡B¤ý§²[, 2014, ¡§À³¥Î¦³¤¸¯Àªk±´°Q©ñ¹q¥[¤u¾÷¤§¥[¤u²G·Å¤É¡¨, ²Ä¤T¤Q¤@©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¤¤, »OÆW. 19. À¹¤l³ó¡B³¯¬f¦w¡B³\´I»Í¡B³¯¤¨»Î¡BĬ¨|¾§, 2014, ¡§¨Ï¥Î·L²Ó½u¤Á³Î©ñ¹q¥[¤uªk¹ï304L¤£ù׿û·L¤Ä¨¤¥[¤u¤§¼vÅT¡¨, ²Ä¤T¤Q¤@©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¤¤, »OÆW. 20. T. Y. Tai,, K.
Y. Chen, T. K. Nguyen, 2014, ¡§the optimal m-EDM parameters For
polycrystalline diamond with different grain size¡¨, 2014 International
Symposium on Nano Science and Technology, Tainan, Taiwan. 21. Y. H. Chang, C.
Liu, T. Y. Tai, 2014, ¡§Resistance Analysis of the new outdoor elderly fitness
equipment¡¨, 5th Conference of Asian Society of Sport Biomechanics, Taipei,
Taiwan. 22. À¹¤l³ó¡B³¯¬f¦w¡B³\´I»Í¡B³¯¤¨»Î¡B³¯©ú·½, 2014, ¡§¥H¥Ð¤fªk¤ÀªR304L¤£ù׿û·L²Ó½u¤Á³Î¥[¤u¤§¬ã¨s¡¨, 2014¦~¼Ò¨ãº[À³¥Î²£·~§Þ³N½×¤åµoªí·|, »O¥_, »OÆW. 23. T. Y. Tai, C.
Liu, C.Y. Kuo, 2014, ¡§Development of elderly
fitness equipment with adjustable resistance in neighbourhood parks¡¨, 19th
Annual Congress of European College of Sport Science, Amsterdam, Holland. 24. À¹¤l³ó¡B³¯¬f¦w¡B³\´I»Í¡B³¯Pºû, 2014, ¡§·L²Ó½u©ñ¹q¥[¤u¹ï¤£¦PV·¾¨¤«×¥[¤uºë«×¤§±´°Q¡¨, 2014ºë±K¾÷±ñ»P»s³y¬ì§Þ¬ã°Q·|, «ÌªF, »OÆW. 25. À¹¤l³ó¡B±iÞ³¥Á¡B¼B±j, 2014, ¡§°ªÄ֪̤½¶éªý¤O¦¡°·ÃM¾÷¤§«Ø¸m¶}µo¡¨, 2014ºÖ¬ç¬ì§Þ»PªA°ÈºÞ²z¾Ç³N¬ã°Q·|, «n§ë, »OÆW. 26. T. Y. Tai, K.
T. Nguyen, and V. N. Vo, 2013, Research of polycrystalline diamond grain size
effect on machining parameters using micro EDM. 2013 International Symposium
on Nano Science and Technology, Tainan, Taiwan. 27. T. Y. Tai, N.
V. Vo, and T. K. Nguyen, 2013, Surface finish of Polycrystalline Diamond
(PCD) by Micro-WEDM. 2013 International Symposium on Nano Science and
Technology, Tainan, Taiwan. 28. ³¯«T´, ¨L®a¦t, À¹¤l³ó, ¤ýµ¾¬P, ¼B±j, ÁéÄ_¥°, 2013, º©¨B¾÷¤UªÏ¨B´T»PÃö¸`¬¡°Ê«×¤§Ãö«Y. 2013°ê»Ú¹B°Ê¥Íª«¤O¾Ç¬ã°Q·|º[»OÆW¹B°Ê¥Íª«¤O¾Ç¬ã°Q·|, ªá½¬,»OÆW. 29. C.Y. Kuo, T. Y. Tai, C. Liu, H. W. Chow, I. Y. Fang,
2013, Development of physical
fitness equipments for elderly in neighbourhood
parks. 20th IAGG World of Congress of Gerontology and Geriatrics, Seoul,
Korea. 30. H. W. Chow, G.
L. Wu, I. Y. Fang, T. Y. Tai, C. Liu, 2013, Outdoor fitness facilities in the
park in Tainan city, Taiwan. 20th IAGG World of Congress of Gerontology and
Geriatrics, Seoul, Korea. 31. F. C. Hsu, T.
Y. Tai, Van Nhan Vo, S. Y. Chen, Y. H. Chen, 2013,
The machining characteristics of polycrystalline diamond (PCD) by Micro-WEDM.
17th International Symposium for Electromaching
(ISEM XVI), Luven, Belgium. 32. T. Y. Tai, V.M.
Nguyen, 2012, ¡§The Effects of Machining Polycrystalline Diamond by
Micro-EDM¡¨, 2nd Annual International Conference on Materials Science,
Metal& Manufacturing, Singapore. 33. â°ê³Ç, §d«aÀM, ¹QºÑÅb, À¹¤l³ó, ©P¾Ç¶², 2012, ¡§³£·|°Ï¤½¶é·s¦¡Åé°·³]¬I¤§¬ã¨s¢w¥H¥x¥_¥«¤Î¥x«n¥«¬°¨Ò¡¨, 2012¦~¹B°Ê»P3Q°ê»Ú¬ã°Q·|, ®ç¶é, »OÆW. 34. ³\´I»Í, À¹¤l³ó, ³¯«äÅt, ³¯¤¨»Î, ³¯©ú·½, 2012, ¡§¦h´¹Æp¥Û¤§·L²Ó½u¤Á³Î¥[¤u¯S©Ê¬ã¨s¡¨, 2012¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW. 35. À¹¤l³ó, ´¿¦N¶©, ±iÞ³¥Á, ³¢¥¿¦t, 2012, ¡§½u¹q·¥©ñ¹q±¿n¦Ê¤À¤ñ¹ï·L²Ó½u¤Á³Î¤§¥[¤uºë«×¬ã¨s¡¨, 2012ºë±K¾÷±ñ»P»s³y¬ì§Þ¬ã°Q·|, «ÌªF, »OÆW. 36. À¹¤l³ó, ¼B±j, ©P¾Ç¶², ³¢¥¿¦t, ±iÞ³¥Á, 2012, ¡§¤½¶é¹B°Ê¾¹§÷¹ï¦Ñ¦~¤HÅé¾A¯à¤§¥\¯à¤ÀªR¡¨, 2012
International Conference on Gerontic Technology and
Service Management, Nantou, Taiwan. 37. T.Y. Tai, D.L.
Nguyen, 2011, ¡§The properties of the hole machined by Micro EDM using
kerosene and de-ionized water as dielectric in comparison¡¨, 2011
International Symposium on Nano Science and Technology, Tainan, Taiwan. 38. T.Y. Tai, H. Y.
Wu, S. Y. Chen, 2011, ¡§A study on micro-hole machining of polycrystalline
diamond and the addition of nickel powder into a micro-EDM dielectric¡¨, 2011
International Symposium on Nano Science and Technology, Tainan, Taiwan. 39. T.Y. Tai, F. C.
Hsu, S. Y. Chen, H. Y. Wu, 2011, ¡§Study of the surface characteristics of
polycrystalline diamond by micro-WEDM¡¨, 2011 International Symposium on Nano
Science and Technology, Tainan, Taiwan. 40. À¹¤l³ó, §d²[¥É, ³¢¥¿¦t, ¨ôº¦z, 2011, ¡¨³æ¹q©·©ñ¹q¥[¤u¨t²Î³]p»PÀ³¥Î¡¨, ²Ä¤G¤Q¤K©¡¾÷±ñ¤uµ{¬ã°Q·|, ¥x¤¤, »OÆW. 41. ³\´I»Í, À¹¤l³ó, §d²[¥É, ³¯¤¨»Î, ³¯Pºû, 2011, ¡§·L²Ó½u¤Á³Î¥[¤u¶¨¨¤ºë«×¤§¬ã¨s¡¨, 2011¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW. 42. Chih-Liang Chu,
Yi-Lin Chen, Tzu-Yao Tai, Yun-Hui Liu, Cheng-Hsin
Chuang, Chin-Tu Lu, 2011, ¡§Development of a 3D
touch trigger probe using micro spherical stylus machining by micro-EDM for
micro-CMM¡¨, 7th International Symposium on Precision Engineering Measurement
and Instrumentation, Lijiang, China. 43. ¹ù^§», À¹¤l³ó, ¼B±j, ¡§¤£¦PºI±³n¦¡ºô²y½u®|¼¯À¿«á¹ï¨ä¾÷±ñ¯S©Ê¤§¼vÅT¡¨, 2011°ê¥ß»O¥_±Ð¨|¤j¾ÇÅé¨|¾Ç³N¬ã°Q·|, »O¥_, ¥xÆW. 44. À¹¤l³ó, §d²[¥É, ³¯«äÅt, ¨ôº¦z, 2011, ¡§©ñ¹q¨t²Î³]p»P»s§@¡¨, 2011²Ä¤©¡´¼¼z«¬¨t²Î¤uµ{À³¥Î¬ã°Q·|, ¥x«n, »OÆW. 45. T.Y. Tai, V. M.
Nguyen, H. N. C. Tran, 2010, ¡§Machining Polycrystalline
Diamond (PCD) Using Micro-Electric Discharge Machine (Micro-EDM), 2010
International Conference on Manufacturing and Engineering Systems, Tainan,
Taiwan. 46. T.Y. Tai, H. N.
C. Tran, V. M. Nguyen, 2010, ¡§Micro EDM with De-Ionized Water and Oil as the
Dielectrics in Comparison, 2010 International Conference on Manufacturing and
Engineering Systems, Tainan, Taiwan. 47. À¹¤l³ó, ¨ôº¦z, ³¯«äÅt, §d²[¥É, ½²´¼³Í, 2010, ¡§¥[¤u²G¤¤²K¥[໯»¹ïSKD11©ó©ñ¹q¥[¤uªí±¤§±´°Q¡¨, ²Ä¤G¤Q¤C©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¥_, »OÆW. 48. À¹¤l³ó, ³¯Pºû, §d²[¥É, ³¯«äÅt, Á¸t±L, 2010, ¡§²K¥[Â쯻¹ïV«¬·L¤Õ·L©ñ¹q¥[¤u¤§¬ã¨s¡¨, ²Ä¤G¤Q¤C©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¥_, »OÆW. 49. À¹¤l³ó, §õ¥Ã¬K, ¨ôº¦z, ªL®m¼Ý, ³¯«äÅt, §d²[¥É, 2010, ¡§§Q¥ÎèpÜg»Ä¹]À£¹q³³²¡§÷®ÆÀ³¥Î©ó°¨¹F½s½X¾¹¤§»s§@¡¨, 2010¦~¤¤°ê§÷®Æ¬ì¾Ç¾Ç·|½×¾Â½×¤å¶°, °ª¶¯, »OÆW. 50. ³\´I»Í, À¹¤l³ó, ³¯Pºû, ³¯¤¨»Î, ¿à¶i²», ´¿¦N¶©, 2010, ¡¨¤u¥ó«p«×¹ï·L²Ó½u¤Á³Î¥[¤u«~½è¤§¬ã¨s¡¨, 2010¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW. 51. À¹¤l³ó, Á¸t±L, ³¯Pºû, 2010, ¡¨ ·L©ñ¹q¤§¥[¤u²G²K¥[Â쯻Áû粒¤j¤p¤Î¿@度¹ïV «¬¹q·¥¦yºÝ®ø¯Ó¤§¬ã¨s¡¨, 2010 ºë±K¾÷±ñ»P»s³y¬ì§Þ¬ã°Q, «ÌªF,»OÆW. 52. F. C. Hsu, T.
Y. Tai, J. S. Lai, Y. Chuang, Y. T. Lyu, M. Y.
Chen, Jack Y. C. Lin, ¡§Evaluation of manufacturing optical mold and die with high aspect ratio by Micro-WEDM
process¡¨, Proceedings of 16th International Symposium for Electromaching
(ISEM XVI), Shanghai, China. 53. À¹¤l³ó, ³\´I»Í, ´¿¦N¶©,¿à ¶i²», ³¯Pºû, 2009, ¡¨ ½u°¾¸m¶q¹ï·L²Ó½u¤Á³Î©ñ¹q¥[¤u¤§¥[¤u¯S©Ê±´°Q¡¨ ,²Ä¤G¤Q¤»©¡¾÷±ñ¤uµ{¬ã°Q·|, »O«n, »OÆW. 54. À¹¤l³ó, Á¸t±L, ³Å¥É»¨, ½²´¼³Í, ¨ô¦u¦z, 2009, ¡§¥[¤u²G¤¤²K¥[Â쯻¹ï·L©ñ¹q¥[¤u¯S©Ê¤§±´°Q¡¨, ²Ä¤G¤Q¤»©¡¾÷±ñ¤uµ{¬ã°Q·|, »O«n, »OÆW. 55. T. Y. Tai, S.
W. Shie, Y. H. Fu, 2009, ¡§The V-cut electrode
morphology process by Micro-EDM¡¨, 2009 International Symposium on Nano
Science and Technology, Tainan, Taiwan. 56. T. Y. Tai, C.
K. Tsai, C. W. Chen, 2009, ¡§The Effect of Cu-Mo composite electrode on SKD11
surface characteristic¡¨, 2009 International Symposium on Nano Science and
Technology, Tainan, Taiwan. 57. T. Y. Tai, C.
W. Chen, C. H. Chuang, S. H. Kang, 2009, ¡§A NEW SURFACE APPROACH BY USING SPM
DISCHARGE LITHOGRAPHY METHOD ¡¨, 2009 International Symposium on Nano Science
and Technology, Tainan, Taiwan. 58. ³\´I»Í, À¹¤l³ó, ¿à¶i²», ²ø®ï, ³¯©ú·½, 2009, ¡§¤u¥ó«p«×¹ï·L²Ó½u¤Á³Î¨¤¶¨»~®t¤§¼vÅT¬ã¨s¡¨, 2009¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW. 59. T. Y. Tai, F.
C. Hsu, J. S. Lai, Y. H. Fu, 2009, ¡§Application of molybdenum copper based
composite electrodes on electrical discharge alloying of SKD11 tool steel ¡§,
2nd International Symposium on Nanostructure, Kyoto, Japan 60. À¹¤l³ó, ¬I¶®¶², ±d²Ð½÷, 2008, ¡§¦N¤BÂίÍÀT·Lµ²ºc¤§¥ú¾Ç¤ÀªR¡¨, ²Ä¤G¤Q¤©¡¾÷±ñ¤uµ{¬ã°Q·|, ¹ü¤Æ, »OÆW. 61. À¹¤l³ó, ¿à¶i²», ³\´I»Í, ´¿¦N¶©, 2008, ¡§·L²Ó½u©ñ¹q¥[¤u°Ñ¼Æ¹ï¤u¥ó«p«×¤§±´°Q¡¨, ²Ä¤G¤Q¤©¡¾÷±ñ¤uµ{¬ã°Q·|, ¹ü¤Æ, »OÆW. 62. À¹¤l³ó, ³Å¥É»¨, ¿à¶i²», Á¸t±L, ²ø®ï, ³\´I»Í, 2008, ¡§©ñ¹q¥[¤u²G²K¥[Â쯻Áû²É¤j¤p¤Î¿@«×¹ï·L²ÓV·¾¼Ñ¥[¤u¯S©Ê¤§±´°Q¡¨, ²Ä¤G¤Q¤©¡¾÷±ñ¤uµ{¬ã°Q·|, ¹ü¤Æ, »OÆW. 63. À¹¤l³ó, ¤ý¤å®p, ³Å¥É»¨, ¶¾©ÀµØ, Á¸t±L, 2008, ¡§»É໽ƦX¹q·¥¹ïSKD11¤u¨ã¿û©ñ¹qµõ¯¾¥Í¦¨¤§¼vÅT¡¨, 2008¦~¤¤°ê§÷®Æ¬ì¾Ç¾Ç·|½×¾Â½×¤å¶°, »O¥_, »OÆW. 64. T. Y. Tai, Y.
H. Fu, S. W. Shie, 2008, ¡§ The relationship between
surface integrity of a V-cut slot and the addition of nickel powder into a
micro-EDM dieleceric¡¨, 2008 International Symposium
on Nano Science and Technology, Tainan, Taiwan. 65. T. Y. Tai, J.
S. Lai, F. C. Hsu, C. L. Tseng, 2008, ¡§ The study of workpiece thickness in
micro-EDM¡¨, 2008 International Symposium on Nano Science and Technology,
Tainan, Taiwan. 66. H. T. Lee, M.
L. Hsieh, F. C. Hsu, Y. Chuang, C. Liu, T. Y. Tai, Jack Y. C. Li, 2008, ¡§An
investigation of electrode manufacturing and micro-hole drilling by
micro-EDM¡¨, 3rd International Conference on Micromanufacturing,
Illinois, USA. 67. ³\´I»Í, À¹¤l³ó, ¿à¶i²», ´¿¦N¶©, 2008, ¡§¤u¥ó«p«×¹ï·L²Ó½u¤Á³Î¥[¤u¯S©Ê¤§¼vÅT¡¨, ²Ä¤»©¡¥þ°êºë±K»s³y¬ã°Q·|, »O«n, »OÆW. 68. ´¿«H´¼, £¹ÅÂ@, À¹¤l³ó, ³¯ïï¥ý, ¤B¸tÛ, ¿½¤D¤¯, 2008, ¡§¼Ò¬y¤ÀªR¦b²b¤ô¾¹¶ì½¦¥~´ß¼Ò¨ã¤§À³¥Î¡¨, 2008¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW. 69. ³\´I»Í, À¹¤l³ó, ¿à¶i²», ²ø®ï, 2008, ¡§·L²Ó½u¤Á³Î©ó¤£¦P§÷®Æ¤§¥[¤u¯S©Ê¬ã¨s¡¨, 2008¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW. 70. ³\´I»Í, À¹¤l³ó, ¿à¶i²», ²ø®ï, ³Å¥É»¨, 2008, ¡§·L²Ó½u¤Á³Îªí±§Î»ª»P¥[¤uºë«×¤§¬ã¨s¡¨, 2008ºë±K¾÷±ñ»P»s³y§Þ³N¬ã°Q·|, ¾Á¤B, »OÆW. 71. À¹¤l³ó, ¶¾©ÀµØ, ³Å¥É»¨, ¿à¶i²», ²ø®ï, ³\´I»Í, 2008, ¡§¥Hà»/»É½Æ¦X¹q·¥§í¨î©ñ¹qµõ¯¾¥Í¦¨¤§¬ã¨s¡¨, 2008ºë±K¾÷±ñ»P»s³y§Þ³N¬ã°Q·|, ¾Á¤B, »OÆW. 72. T. Y. Tai, H.
T. Lee, F. C. Hsu, 2008, ¡§Improvement of Fatigue Life by Reducing the
Formation of Crack during EDM Process¡¨, 13th International Conference on
Applied Mechanics and Mechanical Engineering, Cairo, Egypt. 73. H. T. Lee , M.
L. Hsieh, F. C. Hsu , Y. Chuang , C. Liu, T. Y. Tai, Jack I. CO. Lin, 2008,
¡¨The study of electrode manufacturing and micro-hole drilling by micro-EDM¡¨,
8th International Joint Workshop on Micro Fabrication, kaohsiung,
Taiwan. 74. T. Y. Tai, Y.
W. Shin, S. H. Kang, 2007, ¡§The nano-scale
microstructure and optical characteristic of Buprestid cuticle¡¨, 2007
International Symposium on Nano Science and Technology, Tainan, Taiwan. 75. T. Y. Tai, N.
H. Feng, Y. H. Fu, J. S. Lai, 2007, ¡§Towards minimization of the EDM cracking
using molybdenum copper based composition electrodes¡¨, 2007 International
Symposium on Nano Science and Technology, Tainan, Taiwan. 76. À¹¤l³ó, ±d²Ð½÷, ¤è±oµØ, £¹ÅÂ@, ¬öªQ¤ô, 2007, ¡§·L»Ä·»²G©ó¤ú¾¦¤§¥Íª«¤O¾Ç¯S©Ê¬ã¨s¡¨, 2007¦~¥Íª«Âå¾Ç¤uµ{¬ã°Q·|, »O¤¤, »OÆW. 77. À¹¤l³ó, §f¾Ç³Ç, ¶¾©ÀµØ, 2007, ¡§¥H¥[¤u°Ñ¼Æ§í¨îµõ¯¾¥Í¦¨ªk§ïµ½©ñ¹q¥[¤uªí±¤§¯h³Ò¹Ø©R¡¨, ²Ä¤G¤Q¥|©¡¾÷±ñ¤uµ{¬ã°Q·|, ¤¤Ãc, »OÆW. 78. À¹¤l³ó, ¤ý«³Åv, ±iµú²±, 2007, ¡§©ñ¹q¥[¤u°Ñ¼Æ¹ï©óÂì°ò¶W¦Xª÷ªí±µõ¯¾¤§¬ã¨s¡¦, ²Ä¤G¤Q¥|©¡¾÷±ñ¤uµ{¬ã°Q·|, ¤¤Ãc, »OÆW. 79. À¹¤l³ó, ¬I¶®¶², ±d²Ð½÷, 2007, ¡¨¦N¤BÂÎªí±¤§µ²ºc»P¥ú¾Ç¯S©Ê¬ã¨s¡¨, 2007¦~¤¤°ê§÷®Æ¬ì¾Ç¾Ç·|½×¾Â½×¤å¶°, ·s¦Ë, »OÆW. 80. À¹¤l³ó, §õ÷~µn, ¤ý«³Åv, ±iµú²±, ¶¾©ÀµØ, 2007, ¡§©ñ¹q¥[¤u°Ñ¼Æ¹ïÂì°ò¶W¦Xª÷IN738¤§µõ¯¾¬ã¨s¡¨, ²Ä¤©¡ºë±K¾÷±ñ»P»s³y§Þ³N¬ã°Q·|, ¾Á¤B, »OÆW. 81. T. Y. Tai, H.
T. Lee, F. C. Hsu, 2007, ¡§The Influence of Working Parameters and Size Effect
on Surface Roughness during EDM Process¡¨, Proceedings of 15th International
Symposium for Electromaching (ISEM XV), Pittsburg, USA. 82. F. C. Hsu, H.
T. Lee, T. Y. Tai, Y. F. Lin and F. Klocke, 2007,
¡§The Feasibility Study of Micro-EDM Hole-Drilling Method for Measuring
Residual Stress¡¨, Proceedings of 15th International Symposium for Electromaching (ISEM XV), Pittsburg,
USA. 83. À¹¤l³ó, §õ÷~µn, §f¾Ç³Ç, 2006, ¡§©ñ¹q¥[¤u¤§ªí±µõ¯¾±Ó·P©Ê¬ã¨s¡¨, »OÆWª÷Äݼö³B²z¾Ç·|¤E¤Q¤¦~½×¤å¬ã°Q·|, »O«n, »OÆW. 84. À¹¤l³ó, ±d²Ð½÷, ¤è±oµØ, £¹ÅÂ@, ¬öªQ¤ô, 2006, ·L¼v§Þ³NÀ³¥Î©ó¥é½ºÁl·Lµ²ºc»s§@»P¥ú¾Ç¤ÀªR, ²Ä¤Q©¡©`¦Ì¤uµ{º[·L¨t²Î§Þ³N¬ã°Q·|, ·s¦Ë, »OÆW. 85. À¹¤l³ó, §õ÷~µn, ¤ý«³Åv, 2006, ¡§SKS93©ñ¹qµõ¯¾»P¥[¤u°Ñ¼ÆÃö«Y¤§¬ã¨s¡¨, ²Ä¤G¤Q¤T©¡¾÷±ñ¤uµ{¬ã°Q·|, »O«n, »OÆW. 86. T. Y. Tai, H.
T. Lee, F. C. Hsu, 2006, ¡§The analysis of the craters formed during micro-EDM
process¡¨, International Workshop on Nano-Structured Materials and Magnetics,
Taipei, Taiwan. 87. F. C. Hsu, H.
T. Lee, T. Y. Tai, D. Thomaidis, G. Antonoglou, D. Lung, F. Klocke,
2006, ¡§The improvement of EDM Hole-Drilling Method for measuring residual
stress by the Micro-EDM technology¡¨, 1st International Conference on Micromanufacturing, Illinois, USA. 88. À¹¤l³ó, §õ÷~µn, ³\´I»Í, T. Masuzawa,
2005, ¡§À³¥Î·L²Ó©ñ¹q¥[¤uªk¦b¼ö§@¤u¨ãèÆp·L¤p²`¤Õ¤§±´°Q¡¨, ²Ä¤G¤Q¤G©¡¾÷±ñ¤uµ{¬ã°Q·|. 89. ³\´I»Í, §õ÷~µn, À¹¤l³ó, D. Thomaidis,
G. Antonoglou, D. Lung, F. Klocke,
2004, ¡§À³¥Î·L©ñ¹q¥[¤u§Þ³N§ï¨}©ñ¹q¥[¤uÆp¤Õªk©ó´Ý¯dÀ³¤O¶q´ú¤§µû¦ô¡¨, ²Ä¤G¤Q¤@©¡¾÷±ñ¤uµ{¬ã°Q·|. 90. À¹¤l³ó, §õ÷~µn, ³\´I»Í, ³¯¬f°¶, 2004, ¡§©ñ¹q¥[¤u°Ñ¼Æ»P¹q·¥¤Ø¤o®ÄÀ³¹ïªí±²ÊÁW«×¤§¼vÅT¡¨, ²Ä¤G¤Q¤@©¡¾÷±ñ¤uµ{¬ã°Q·|. 91. T. Y. Tai, H.
T. Lee, F. C. Hsu, 2004, ¡§The analysis of the surface integrity in micro-EDM
Process¡¨, 2004 International Symposium on Nano Science and Technology,
Tainan, Taiwan. 92. §õ÷~µn, À¹¤l³ó, W. P. Rehbach,
R. Harscheidt, 2004, ¡§¥H±½ºË¦¡¹q¤lÅã·LÃè¡B¹p®g¦@µJ±½ºËÅã·LÃè»P¥Õ¥ú¤z¯A»öÀË´ú©ñ¹q¥[¤uÆp¤Õ¤§¤ñ¸û¡§, ¤¤µØ¥Á°ê²Ä¤K©¡¯}Ãa¬ì¾Ç¬ã°Q·|. 93. H. T. Lee, W.
P. Rehbach, F. C. Hsu, T. Y. Tai, Edward Hsu, 2004,
¡§The Study of EDM Hole-Drilling Method for Measuring Residual Stress in SKD11
Tool Steel¡¨, Proceedings of 14th International Symposium for Electromaching (ISEM), Edinburgh, England. 94. H. T. Lee, T.
Y. Tai, W. P. Rehbach, R. Harscheidt,
2003, ¡§Darstellung und Vermessung
von mittels Funkenerosion
erzeugten Bohrungen mit Weißlicht-Interferometrie, konfokaler Lasermikroskopie und
Stereo- Rasterelektronenmikroskopie¡¨, Vortragstexte
der 37. Metallographie-Tagung, pp. 187-191. |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¡@§Þ³N³ø§i |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
1.
À¹¤l³ó (201708), ¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{pµe-¡uºë±K¥[¤u»s³y¤H¤~°ö°Vpµe¡vµ²®×³ø§i 2.
À¹¤l³ó(2016,10) ´¼¯à¤Æ¨T¨®¹s²Õ¥ó»s³yÃì¾ã¦X»²¾É´£¤Épµeµ²®×³ø§i 3.
À¹¤l³ó(2015,08), 104¾Ç¦~«×¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{º[¦@³q®Ö¤ß¾¯à½Òµ{±M¯Z-ºë±K¥[¤u»s³y¤H¤~°ö°Vpµeµ²®×³ø§i 4.
À¹¤l³ó(2015,06), «Ø¥ß¹p®gÀJ¨èÜg¦Xª÷ªí±§½³¡µo¦â³B²z¤§°Ñ¼Æ¸ê®Æ®w¦¨ªG³ø§i 5.
À¹¤l³ó(2014,05), ©ñ¹q¥[¤u¾÷¾÷¥x¼öÅܧΤÀªR¦¨ªG³ø§i 6.
À¹¤l³ó,¹ù§Ó¤É(2011.02), °ê¬ì·|¤j±M¾Ç¥Í°Ñ»P±MÃD¬ã¨spµe-¡u¸}½ñ¨®¯à·½Âà´«¤§À³¥Î(99-2815-C-218-049-E)¡v¦¨ªG³ø§i 7.
À¹¤l³ó(2009.11), ¾Ç¬É¨ó§U¤¤¤p¥ø·~¬ì§ÞÃöÃhpµe, ¡u¯S®í¿û¼Ò¨ã¥[¤u§Þ³N²~ÀV¿Ô¸ß»P¸Ñ¨M¤§¤è®×¡vµ²®×³ø§i¡C 8.
À¹¤l³ó(2009.09), ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß²£¾Ç¦X§@®×, ¡u¬ï½u¾÷ºc¤ÀªR»P»s¹Ï¡v´Á¥½³ø§i¡C 9.
À¹¤l³ó¡B¼B©ø©¾¡B§õs¼z¡B§d©Ó¶©(2009.05)¡A±Ð¨|³¡ÅU°Ý«Ç®ü¬v±Ð¨|¥ý¾É«¬pµe, ªë¥Ø³½ªº¬G¶m¡X°ê¤p±Ð§÷¡C 10.
À¹¤l³ó¡B¼B©ø©¾¡B§õs¼z¡B§d©Ó¶©(2009.05)¡A±Ð¨|³¡ÅU°Ý«Ç®ü¬v±Ð¨|¥ý¾É«¬pµe, ªë¥Ø³½ªº¬G¶m¡X°ê¤¤±Ð§÷¡C 11.
³¯¥¿¨k,¤B§Ó§»,À¹¤l³ó,Ĭ¶¶µo,¶À¤å§»,´¿Û±R(2008.09), °]¹Îªk¤Hºë±K¾÷±ñ¬ã¨sµo®i¤¤¤ß©e°U¬ã¨s®×¡X¡u¾÷±ñ¹s²Õ¥ó¼Ò²Õ¤Æªº§Þ³N¤ÀªR¬ã¨s¡v´Á¥½³ø§i¡C 12.
À¹¤l³ó¡B³¯«a§»(2008.03),
°ê¬ì·|¤j±M¾Ç¥Í°Ñ»P±MÃD¬ã¨spµe¡X¡u»É¥d¤Øªº×´_»P¬ã¨s(97-2815-C-218-019-E)¡v¦¨ªG³ø§i 13.
À¹¤l³ó, ´¿«H´¼, Ĭ¶¶µo(2007.11), «~°í¤u·~ªÑ¥÷¦³¤½¥q²£¾Ç¦X§@®×, ¡u²B®ð»s³y¾÷²B¥i¦æ©Ê³W¹º¤§¬ã¨s¡v´Á¥½³ø§i 14. ´¿«H´¼, À¹¤l³ó (2009.10), «~°í¤u·~ªÑ¥÷¦³¤½¥q²£¾Ç¦X§@®×, ¡u¦h¥\¯à²b¤ô¹LÂo¾¹¤§¬ã¨s¡v´Á¥½³ø§i |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¡@±M§Q |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¡@¬ã¨spµe |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2017/05~2017/10 ¨T¾÷¨®¹s²Õ¥ó´¼¯à»ùÈÃì»Pºë±K¼Ò¨ã¾ã¦X»²¾É´£¤Épµe, pµe¤À¶µ¥D«ù¤H,
ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(72,000) 2016/07~2017/08 105¾Ç¦~«×¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{pµe-ºë±K¥[¤u»s³y¤H¤~°ö°Vpµe,
pµe¥D«ù¤H, ³Ò°Ê³¡(750,000) 2016/05~2016/10 ´¼¯à¤Æ¨T¨®¹s²Õ¥ó»s³yÃì¾ã¦X»²¾É´£¤Épµe, pµe¥D«ù¤H,
ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(192,000) 2015/08~2016/07 «Øºc°ªÄ֪̹B°Ê¤ä«ù¨t²Î¤§¬ã¨s(II)¡Ð¨ÌÂà³t¦Û½Õªý力¦¡°ªÄ֪̤½¶éÅé,
pµe¥D«ù¤H,¬ì§Þ³¡(656,000), MOST 104-2410-H-218 -014 2015/07~2016/08 104¾Ç¦~«×¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{º[¦@³q®Ö¤ß¾¯à½Òµ{±M¯Z-ºë±K¥[¤u»s³y¤H¤~°ö°Vpµe,
pµe¥D«ù¤H, ³Ò°Ê³¡(750,000). 2015/05~2015/10 ¨T¾÷¨®¹q¾¹¹s²Õ¥óº[ºë±K¾÷±ñ¸ó»â°ì§Þ³N»²¾É´£¤Épµe, pµe¤À¶µ¥D«ù¤H,
ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(144,000) 2015/08~2016/07 «Øºc°ªÄ֪̹B°Ê¤ä«ù¨t²Î¤§¬ã¨s¡Ð¨ÌÂà³t¦Û½Õªý¤O¦¡°ªÄ֪̤½¶éÅé¾A¯à¾¹§÷«Ø¸m¶}µo, pµe¥D«ù¤H,¬ì§Þ³¡(633,000), MOST 103-2410-H-218 -021 2014/07~2015/08 104¦~«×¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{pµe-ºë±K¥[¤u»s³y¤H¤~°ö°Vpµe,
pµe¥D«ù¤H, ³Ò°Ê³¡(750,000) 2014/07~2015/06 «Ø¥ß¹p®gÀJ¨èÜg¦Xª÷ªí±§½³¡µo¦â³B²z¤§°Ñ¼Æ¸ê®Æ®w, pµe¥D«ù¤H,
§Ó¿ûª÷Äݪѥ÷¦³¤½¥q(65,000) 2014/05~2014/10 ¨T¾÷¨®¹s²Õ¥ó¼t¸ó»â°ì§Þ³N»²¾É´£¤Épµe, pµe¤À¶µ¥D«ù¤H,
ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(72,000) 2014/01~2015/05 ©ñ¹q¥[¤u¾÷¾÷¥x¼öÅܧΤÀªR, pµe¥D«ù¤H,
»õÂ`¥ø·~ªÑ¥÷¦³¤½¥q(50,000) 2014/08~2015/07 ¥i½Õ¾ãªý¤O¦¡°ªÄ֪̤½¶éÅé¾A¯à¾¹§÷«Ø¸m¶}µo, pµe¥D«ù¤H,¬ì§Þ³¡(782,000), MOST 102-2410-H-218 -024 2012/01~2013/06 ¶W°ª´`Àô¦h¼Ò¥Þ¼ä²b²£«~Turn Key¹q°Êºë±K®g¥X¦¨«¬¨t²Î¶}µo,
pµe¥D«ù¤H,¥þ¥ßµo¾÷±ñ¼tªÑ¥÷¦³¤½¥q(4,400,000) 2012/05~2012/10 «n¥xÆWºë±K¾÷±ñ²£·~»E¸¨¦Û°Ê¤Æ»P¸ê³q§Þ³N¾É¤J»²¾É±M®×, pµe¥D«ù¤H,
ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(200,000) 2012/05~2012/10 ºë±K°ª¶¥¼Ò¨ã¥[ȤƤ§´£¤É, pµe¥D«ù¤H,
§Q·¸Â×¹ê·~¦³¤½¥q(72,000)
|
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
¡@ªA°È |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2018/07~2018/07 ¦¨¥\¤j¾Ç¾÷±ñ¨t, ºÓ¤h¾Ç¦ì¦Ò¸Õ©eû 2018/02~2018/07 106¾Ç¦~«×®Õ°È·|ij¥Nªí 2017/12~2017/12 ¤¤°ê¾÷±ñ¤uµ{¾Ç·|²Ä34©¡¥þ°ê¾Ç³N¬ã°Q·|,
¤À²Õ¥D«ù¤H 2017/08~2018/01 106¾Ç¦~«×(¨t)®Õ¥~¹ê²ß©eû·| 2017/08~2018/01 106¾Ç¦~«×(¨t)°ò¦½Òµ{»²¾É©eû·| 2017/07~2017/07 ¦¨¥\¤j¾Ç¾÷±ñ¨t, ºÓ¤h¾Ç¦ì¦Ò¸Õ©eû 2016/08~2017/07 105¾Ç¦~«×(¨t)°ò¦½Òµ{»²¾É©eû·| 2016/08~2017/07 105¾Ç¦~«×(¨t)»ö¾¹³]³Æ³W¹º©eû·| 2015/12~2015/12 ¤¤°ê¾÷±ñ¤uµ{¾Ç·|²Ä32©¡¥þ°ê¾Ç³N¬ã°Q·|,
¤À²Õ¥D«ù¤H
|