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2.     ¼w°ê­C®³¤j¾Ç(Friedrich-Schiller Universitaet Jena) ³X°Ý¾ÇªÌ (2008.07-2008.08)

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¡@´Á¥Z½×¤å

1.      T.Y. Tai, K. T. Nguyen, 2016, ¡§The Grain Size Effect of Polycrystalline Diamond on Surface Integrity by Using Micro EDM¡¨, Procedia CIRP, Vol. 42, pp.305-310.

2.      F. C. Hsu, T. Y. Tai, Van Nhan Vo, S. Y. Chen, Y. H. Chen, 2013, ¡§The machining characteristics of polycrystalline diamond (PCD) by Micro-WEDM¡¨, Procedia CIRP, Vol. 6, pp.262-267.

3.      T. Y. Tai, S. J. Lu, Y. H. Chen, 2011, ¡§Surface crack susceptibility of electrodischarge machined steel surfaces¡¨, International Journal of Advanced Manufacturing Technology, Vol. 57, Issue 9, pp. 983~989. (SCI,EI)

4.      H. T. Lee, T. Y. Tai, C. Liu, F. C. Hsu, J. M. Hsu, 2011, ¡§Effect of Material Physical Properties on Residual Stress Measurement by EDM Hole-Drilling Method¡¨, Journal of Engineering Materials and Technology, Vol.113, No.2, pp. 021014-1~021014-8. (SCI, EI)

5.      S. H. Kang, T. Y. Tai, T. H. Fang, 2010, ¡§Replication of bionic butterfly wing microstructures using soft lithography¡¨, Current Applied Physics, Vol. 10, No. 2, pp. 625-630. 2010.(SCI, EI)

6.      T. Y. Tai, S. J. Lu, 2009, ¡§Improving the Fatigue Life of Electro-Discharge Machined SKD11 Tool Steel Via the Suppression of Surface Cracks¡¨, International Journal of Fatigue, Vol. 31, No.3, pp. 433-438. (SCI, EI)

7.      T. Y. Tai, T. Masusawa and H. T. Lee, 2007, ¡§Drilling Microholes in Hot Tool Steel by Using Micro-Electro Discharge Machining¡¨, Materials Transactions, Vol. 48, No. 2, pp. 205-210. ( SCI, EI)

8.      H. T. Lee, J. Mayer, F. C. Hsu, W. P. Rehbach, T. Weirich, A. Dimyati, T. Y. Tai, 2006, ¡¨ Application of EDM Hole-Drilling to the Measurement of Residual Stress in Tool and Carbon Steels¡¨, Journal of Engineering Materials and Technology, Vol. 3, No. 128, pp. 468-475. (SCI, EI)

9.      H. T. Lee, W. P. Rehbach, T. Y. Tai, F. C. Hsu, 2004, ¡§Relationship between Electrode Size and Surface Cracking in the EDM Machining Process¡¨, Journal of Materials Science, Vol. 39, No.23, pp. 6981-6986. (SCI, EI)

10.   H. T. Lee, W. P. Rehbach, F. C. Hsu, T. Y. Tai, Edward Hsu, 2004, ¡§The Study of EDM Hole-Drilling Method for Measuring Residual Stress in SKD11 Tool Steel¡¨, Journal of Material Processing Technology, Vol.149, pp. 88-93. (SCI, EI)

11.   H. T. Lee, F.C. Hsu, T. Y. Tai, 2004, ¡§Study of surface integrity using the small area EDM process with a copper-tungsten electrode¡¨, Material Science and Engineering A, Vol. 364, pp. 346-356. (SCI, EI)

12.   H. T. Lee, W. P. Rehbach, T. Y. Tai, F. C. Hsu, 2003, ¡§Surface Integrity in Micro- Hole Drilling Using Micro-Electro Discharge Machining¡¨, Materials Transaction, Vol. 44, No. 12, pp. 2718-2722. (SCI, EI)

13.   H. T. Lee and T. Y. Tai, 2003, ¡§Relationship between EDM Parameters and Surface Crack Formation¡¨, Journal of Material Processing Technology, Vol. 142, No. 3, pp. 676-683. (SCI, EI)

¡@¬ã°Q·|½×¤å

1.      Tzu-Yao Tai, Nian-Hua Feng, 2018, ¡§An experimental investigation into the electro-discharge machining of SKD11 tool steel using composite copper-molybdenum electrodes¡¨, IEEE International Conference on Applied System Innovation 2018, Tokyo, Japan.

2.      ¶¾¥@´a¡BÀ¹¤l³ó¡B´¿«T®Ë, 2017, ¡§À³¥Î­Ë¶Ç»¼ªk©ó¥Û¾¥¹q·¥¤§©ñ¹q¥[¤uªí¼h¯S©Ê¹w´ú¡¨, ²Ä¤T¤Q¥|©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¤¤, »OÆW.

3.      ¶ÀµÏ­³¡BÀ¹¤l³ó¡B§fÂ@, 2017, ¡§¥H¥Ð¤fªk©MÃþ¯«¸gºô¸ô±´°Q¥Û¾¥©M¬õ»É¹q·¥¹ïSKD11§N§@¤u¨ã¿û©ñ¹q¥[¤u¤§µ²ªG¡¨, ²Ä¤T¤Q¥|©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¤¤, »OÆW.

4.      Jun Lyu,Tzu-Yao Tai,and Shun-Wei Huang, 2017, ¡§THE EFFECTS OF GRAPHITE AND COPPER ELECTRODE ON EDMED SURFACE OF SKD11 COLD TOOL STEEL BY USING TAGUCHI METHOD¡¨, 2017 INTERNATIONAL SYMPOSIUM ON NOVEL AND SUSTAINABLE TECHNOLOGY, Tainan, Taiwan.

5.      J.Y. Zeng, T.Y. Tai, and S.H. Feng, 2017, ¡§The prediction of surface integrity on EDMed surface with graphite electrode by using back propagation method¡¨, 2017 INTERNATIONAL SYMPOSIUM ON NOVEL AND SUSTAINABLE TECHNOLOGY, Tainan, Taiwan.

6.      Tzu-Yao Tai, Hung-Chang Chen, 2017, ¡§The Effect of Adding Nickel Powder into the Dielectric Fluid by Using Micro EDM Process¡¨, Materials, Methods & Technologies, BULGARIA

7.      H.Z. Chen, T. Y. Tai, and Y.H. Wang, 2016, ¡§Stationary Bike with Continuously Variable Tramission of Resistance¡¨, 2016 International Symposium on Novel and Sustanable Technology, Tainan, Taiwan.

8.      S.H. Feng, T.Y. Tai, and G.Y. Chen, 2016, ¡§The Influence of Recast Layer on Tool Steel under Different Step during EDM Process¡¨, 2016 International Symposium on Novel and Sustanable Technology, Tainan, Taiwan.

9.      T. Y. Tai, S. W. Huang, and G. Y. Chen, 2016, ¡§The influence of EDM Electrode Wear of Different Working Step during EDM Process¡¨, 2016 International Symposium on Novel and Sustanable Technology, Tainan, Taiwan.

10.   T. Y. Tai, Y. H. Wang, 2016, ¡§Development of self-adjusting resistance by rotating speed to physical fitness equipment for elderly in neighborhood parks¡¨, 21st Annual Congress of the European College of Sport Science, Vienna, Austria.

11.   T. Y. Tai, K. T. Nguyen, 2016, ¡§The Grain Size Effect of Polycrystalline Diamond on Surface Integrity by Using Micro EDM¡¨, 18th CIRP Conference on Electro Physical and Chemical Machining (ISEM XVIII), Tokyo, Japan.

12.   À¹¤l³ó¡BĬ¨|¾§¡B³\´I»Í¡B³¯­Pºû, 2015, ¡§·L²Ó½u©ñ¹q¥[¤u¹ïV·¾¾¦¶Zºë«×¤§±´°Q¡¨, ²Ä¤T¤Q¤G©¡¾÷±ñ¤uµ{¬ã°Q·|, °ª¶¯, »OÆW.

13.   À¹¤l³ó¡B¤ý­§²[¡B¼B±j¡B³¢¥¿¦t, 2015, ¡§¥i½Õªý¤O¦¡²GÀ£¤WªÏÅé¾A¯à¾¹§÷«Ø¸m¬ãµo¡¨, ²Ä¤T¤Q¤G©¡¾÷±ñ¤uµ{¬ã°Q·|, °ª¶¯, »OÆW.

14.   À¹¤l³ó¡BÁ©s§»¡B³\´I»Í¡B³¯¤¨»Î¡B³¯¬f¦w, 2015, ¡§¶}µo½u¤Á³Î²Ä¤»¶b¥ß¦¡±ÛÂà©w¦ì¥­¥x¹ï304L¤£Äÿû·L¤Ä¨¤¥[¤u¤§¬ã¨s¡¨, ²Ä¤T¤Q¤G©¡¾÷±ñ¤uµ{¬ã°Q·|, °ª¶¯, »OÆW.

15.   K. T. Nguyen,T. Y. Tai, 2015, ¡§Micro Hole Drilling on PCD by Micro EDM Technology¡¨, 2015 International Symposium on Nano Science and Technology, Tainan, Taiwan.

16.   K. T. Nguyen, T. Y. Tai, K. Y. Chen, 2015, ¡§The Influence of PCD Grain Size on Machining Characteristics¡¨, 2015 International Symposium on Nano Science and Technology, Tainan, Taiwan.

17.   T. Y. Tai, C. Liu, C. Y. Kuo, 2015, ¡§Development of adjustable resistance mechanism to physical fitness equipment for elderly in neighborhood parks¡¨, 20th Annual Congress of European College of Sport Science, Malmoe, Sweden.

18.   À¹¤l³ó¡B³¯¨Èºû¡B³¯«a¦t¡B¤ý­§²[, 2014, ¡§À³¥Î¦³­­¤¸¯Àªk±´°Q©ñ¹q¥[¤u¾÷¤§¥[¤u²G·Å¤É¡¨, ²Ä¤T¤Q¤@©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¤¤, »OÆW.

19.   À¹¤l³ó¡B³¯¬f¦w¡B³\´I»Í¡B³¯¤¨»Î¡BĬ¨|¾§, 2014, ¡§¨Ï¥Î·L²Ó½u¤Á³Î©ñ¹q¥[¤uªk¹ï304L¤£ù׿û·L¤Ä¨¤¥[¤u¤§¼vÅT¡¨, ²Ä¤T¤Q¤@©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¤¤, »OÆW.

20.   T. Y. Tai,, K. Y. Chen, T. K. Nguyen, 2014, ¡§the optimal m-EDM parameters For polycrystalline diamond with different grain size¡¨, 2014 International Symposium on Nano Science and Technology, Tainan, Taiwan.

21.   Y. H. Chang, C. Liu, T. Y. Tai, 2014, ¡§Resistance Analysis of the new outdoor elderly fitness equipment¡¨, 5th Conference of Asian Society of Sport Biomechanics, Taipei, Taiwan.

22.   À¹¤l³ó¡B³¯¬f¦w¡B³\´I»Í¡B³¯¤¨»Î¡B³¯©ú·½, 2014, ¡§¥H¥Ð¤fªk¤ÀªR304L¤£ù׿û·L²Ó½u¤Á³Î¥[¤u¤§¬ã¨s¡¨, 2014¦~¼Ò¨ãº[À³¥Î²£·~§Þ³N½×¤åµoªí·|, »O¥_, »OÆW.

23.   T. Y. Tai, C. Liu, C.Y. Kuo, 2014, ¡§Development of elderly fitness equipment with adjustable resistance in neighbourhood parks¡¨, 19th Annual Congress of European College of Sport Science, Amsterdam, Holland.

24.   À¹¤l³ó¡B³¯¬f¦w¡B³\´I»Í¡B³¯­Pºû, 2014, ¡§·L²Ó½u©ñ¹q¥[¤u¹ï¤£¦PV·¾¨¤«×¥[¤uºë«×¤§±´°Q¡¨,  2014ºë±K¾÷±ñ»P»s³y¬ì§Þ¬ã°Q·|, «ÌªF, »OÆW.

25.   À¹¤l³ó¡B±iÞ³¥Á¡B¼B±j, 2014, ¡§°ªÄ֪̤½¶éªý¤O¦¡°·ÃM¾÷¤§«Ø¸m¶}µo¡¨,  2014ºÖ¬ç¬ì§Þ»PªA°ÈºÞ²z¾Ç³N¬ã°Q·|, «n§ë, »OÆW.

26.   T. Y. Tai, K. T. Nguyen, and V. N. Vo, 2013, Research of polycrystalline diamond grain size effect on machining parameters using micro EDM. 2013 International Symposium on Nano Science and Technology, Tainan, Taiwan.

27.   T. Y. Tai, N. V. Vo, and T. K. Nguyen, 2013, Surface finish of Polycrystalline Diamond (PCD) by Micro-WEDM. 2013 International Symposium on Nano Science and Technology, Tainan, Taiwan.

28.   ³¯«T´­, ¨L®a¦t, À¹¤l³ó, ¤ýµ¾¬P, ¼B±j, ÁéÄ_¥°, 2013, º©¨B¾÷¤UªÏ¨B´T»PÃö¸`¬¡°Ê«×¤§Ãö«Y. 2013°ê»Ú¹B°Ê¥Íª«¤O¾Ç¬ã°Q·|º[»OÆW¹B°Ê¥Íª«¤O¾Ç¬ã°Q·|, ªá½¬,»OÆW.

29.   C.Y. Kuo, T. Y. Tai, C. Liu, H. W. Chow, I. Y. Fang, 2013,  Development of physical fitness equipments for elderly in neighbourhood parks. 20th IAGG World of Congress of Gerontology and Geriatrics, Seoul, Korea.

30.   H. W. Chow, G. L. Wu, I. Y. Fang, T. Y. Tai, C. Liu, 2013, Outdoor fitness facilities in the park in Tainan city, Taiwan. 20th IAGG World of Congress of Gerontology and Geriatrics, Seoul, Korea.

31.   F. C. Hsu, T. Y. Tai, Van Nhan Vo, S. Y. Chen, Y. H. Chen, 2013, The machining characteristics of polycrystalline diamond (PCD) by Micro-WEDM. 17th International Symposium for Electromaching (ISEM XVI), Luven, Belgium.

32.   T. Y. Tai, V.M. Nguyen, 2012, ¡§The Effects of Machining Polycrystalline Diamond by Micro-EDM¡¨, 2nd Annual International Conference on Materials Science, Metal& Manufacturing, Singapore.

33.   ­â°ê³Ç, §d«aÀM, ¹QºÑÅb, À¹¤l³ó, ©P¾Ç¶², 2012, ¡§³£·|°Ï¤½¶é·s¦¡Åé°·³]¬I¤§¬ã¨s¢w¥H¥x¥_¥«¤Î¥x«n¥«¬°¨Ò¡¨,  2012¦~¹B°Ê»P3Q°ê»Ú¬ã°Q·|, ®ç¶é, »OÆW.

34.   ³\´I»Í, À¹¤l³ó, ³¯«äÅt, ³¯¤¨»Î, ³¯©ú·½, 2012, ¡§¦h´¹Æp¥Û¤§·L²Ó½u¤Á³Î¥[¤u¯S©Ê¬ã¨s¡¨, 2012¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW.

35.   À¹¤l³ó, ´¿¦N¶©, ±iÞ³¥Á, ³¢¥¿¦t, 2012, ¡§½u¹q·¥©ñ¹q­±¿n¦Ê¤À¤ñ¹ï·L²Ó½u¤Á³Î¤§¥[¤uºë«×¬ã¨s¡¨, 2012ºë±K¾÷±ñ»P»s³y¬ì§Þ¬ã°Q·|, «ÌªF, »OÆW.

36.   À¹¤l³ó, ¼B±j, ©P¾Ç¶², ³¢¥¿¦t, ±iÞ³¥Á, 2012, ¡§¤½¶é¹B°Ê¾¹§÷¹ï¦Ñ¦~¤HÅé¾A¯à¤§¥\¯à¤ÀªR¡¨, 2012 International Conference on Gerontic Technology and Service Management, Nantou, Taiwan.

37.   T.Y. Tai, D.L. Nguyen, 2011, ¡§The properties of the hole machined by Micro EDM using kerosene and de-ionized water as dielectric in comparison¡¨, 2011 International Symposium on Nano Science and Technology, Tainan, Taiwan.

38.   T.Y. Tai, H. Y. Wu, S. Y. Chen, 2011, ¡§A study on micro-hole machining of polycrystalline diamond and the addition of nickel powder into a micro-EDM dielectric¡¨, 2011 International Symposium on Nano Science and Technology, Tainan, Taiwan.

39.   T.Y. Tai, F. C. Hsu, S. Y. Chen, H. Y. Wu, 2011, ¡§Study of the surface characteristics of polycrystalline diamond by micro-WEDM¡¨, 2011 International Symposium on Nano Science and Technology, Tainan, Taiwan.

40.   À¹¤l³ó, §d²[¥É, ³¢¥¿¦t, ¨ô­º¦z, 2011, ¡¨³æ¹q©·©ñ¹q¥[¤u¨t²Î³]­p»PÀ³¥Î¡¨, ²Ä¤G¤Q¤K©¡¾÷±ñ¤uµ{¬ã°Q·|, ¥x¤¤, »OÆW.

41.   ³\´I»Í, À¹¤l³ó, §d²[¥É, ³¯¤¨»Î, ³¯­Pºû, 2011, ¡§·L²Ó½u¤Á³Î¥[¤u¶¨¨¤ºë«×¤§¬ã¨s¡¨, 2011¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW.

42.   Chih-Liang Chu, Yi-Lin Chen, Tzu-Yao Tai, Yun-Hui Liu, Cheng-Hsin Chuang, Chin-Tu Lu, 2011, ¡§Development of a 3D touch trigger probe using micro spherical stylus machining by micro-EDM for micro-CMM¡¨, 7th International Symposium on Precision Engineering Measurement and Instrumentation, Lijiang, China.

43.   ¹ù­^§», À¹¤l³ó, ¼B±j, ¡§¤£¦PºI­±³n¦¡ºô²y½u®|¼¯À¿«á¹ï¨ä¾÷±ñ¯S©Ê¤§¼vÅT¡¨, 2011°ê¥ß»O¥_±Ð¨|¤j¾ÇÅé¨|¾Ç³N¬ã°Q·|, »O¥_, ¥xÆW.

44.   À¹¤l³ó, §d²[¥É, ³¯«äÅt, ¨ô­º¦z, 2011, ¡§©ñ¹q¨t²Î³]­p»P»s§@¡¨, 2011²Ä¤­©¡´¼¼z«¬¨t²Î¤uµ{À³¥Î¬ã°Q·|, ¥x«n, »OÆW.

45.   T.Y. Tai, V. M. Nguyen, H. N. C. Tran, 2010, ¡§Machining Polycrystalline Diamond (PCD) Using Micro-Electric Discharge Machine (Micro-EDM), 2010 International Conference on Manufacturing and Engineering Systems, Tainan, Taiwan.

46.   T.Y. Tai, H. N. C. Tran, V. M. Nguyen, 2010, ¡§Micro EDM with De-Ionized Water and Oil as the Dielectrics in Comparison, 2010 International Conference on Manufacturing and Engineering Systems, Tainan, Taiwan.

47.   À¹¤l³ó, ¨ô­º¦z, ³¯«äÅt, §d²[¥É, ½²´¼³Í, 2010, ¡§¥[¤u²G¤¤²K¥[໯»¹ïSKD11©ó©ñ¹q¥[¤uªí­±¤§±´°Q¡¨, ²Ä¤G¤Q¤C©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¥_, »OÆW.

48.   À¹¤l³ó, ³¯­Pºû, §d²[¥É, ³¯«äÅt, Á¸t±L, 2010, ¡§²K¥[Â쯻¹ïV«¬·L¤Õ·L©ñ¹q¥[¤u¤§¬ã¨s¡¨, ²Ä¤G¤Q¤C©¡¾÷±ñ¤uµ{¬ã°Q·|, »O¥_, »OÆW.

49.   À¹¤l³ó, §õ¥Ã¬K, ¨ô­º¦z, ªL®m¼Ý, ³¯«äÅt, §d²[¥É, 2010, ¡§§Q¥ÎèpÜg»Ä¹]À£¹q³³²¡§÷®ÆÀ³¥Î©ó°¨¹F½s½X¾¹¤§»s§@¡¨, 2010¦~¤¤°ê§÷®Æ¬ì¾Ç¾Ç·|½×¾Â½×¤å¶°, °ª¶¯, »OÆW.

50.   ³\´I»Í, À¹¤l³ó, ³¯­Pºû, ³¯¤¨»Î, ¿à¶i²», ´¿¦N¶©, 2010, ¡¨¤u¥ó«p«×¹ï·L²Ó½u¤Á³Î¥[¤u«~½è¤§¬ã¨s¡¨, 2010¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW.

51.   À¹¤l³ó, Á¸t±L, ³¯­Pºû, 2010, ¡¨ ·L©ñ¹q¤§¥[¤u²G²K¥[Â쯻Áû粒¤j¤p¤Î¿@度¹ïV «¬¹q·¥¦yºÝ®ø¯Ó¤§¬ã¨s¡¨, 2010 ºë±K¾÷±ñ»P»s³y¬ì§Þ¬ã°Q, «ÌªF,»OÆW.

52.   F. C. Hsu, T. Y. Tai, J. S. Lai, Y. Chuang, Y. T. Lyu, M. Y. Chen, Jack Y. C. Lin, ¡§Evaluation of manufacturing optical mold and die with high aspect ratio by Micro-WEDM process¡¨, Proceedings of 16th International Symposium for Electromaching (ISEM XVI), Shanghai, China.

53.   À¹¤l³ó, ³\´I»Í, ´¿¦N¶©,¿à ¶i²», ³¯­Pºû, 2009, ¡¨ ½u°¾¸m¶q¹ï·L²Ó½u¤Á³Î©ñ¹q¥[¤u¤§¥[¤u¯S©Ê±´°Q¡¨ ,²Ä¤G¤Q¤»©¡¾÷±ñ¤uµ{¬ã°Q·|, »O«n, »OÆW.

54.   À¹¤l³ó, Á¸t±L, ³Å¥É»¨, ½²´¼³Í, ¨ô¦u¦z, 2009, ¡§¥[¤u²G¤¤²K¥[Â쯻¹ï·L©ñ¹q¥[¤u¯S©Ê¤§±´°Q¡¨, ²Ä¤G¤Q¤»©¡¾÷±ñ¤uµ{¬ã°Q·|, »O«n, »OÆW.

55.   T. Y. Tai, S. W. Shie, Y. H. Fu, 2009, ¡§The V-cut electrode morphology process by Micro-EDM¡¨, 2009 International Symposium on Nano Science and Technology, Tainan, Taiwan.

56.   T. Y. Tai, C. K. Tsai, C. W. Chen, 2009, ¡§The Effect of Cu-Mo composite electrode on SKD11 surface characteristic¡¨, 2009 International Symposium on Nano Science and Technology, Tainan, Taiwan.

57.   T. Y. Tai, C. W. Chen, C. H. Chuang, S. H. Kang, 2009, ¡§A NEW SURFACE APPROACH BY USING SPM DISCHARGE LITHOGRAPHY METHOD ¡¨, 2009 International Symposium on Nano Science and Technology, Tainan, Taiwan.

58.   ³\´I»Í, À¹¤l³ó, ¿à¶i²», ²ø®ï, ³¯©ú·½, 2009, ¡§¤u¥ó«p«×¹ï·L²Ó½u¤Á³Î¨¤¶¨»~®t¤§¼vÅT¬ã¨s¡¨, 2009¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW.

59.   T. Y. Tai, F. C. Hsu, J. S. Lai, Y. H. Fu, 2009, ¡§Application of molybdenum copper based composite electrodes on electrical discharge alloying of SKD11 tool steel ¡§, 2nd International Symposium on Nanostructure, Kyoto, Japan

60.   À¹¤l³ó, ¬I¶®¶², ±d²Ð½÷, 2008,  ¡§¦N¤BÂίÍÀT·Lµ²ºc¤§¥ú¾Ç¤ÀªR¡¨, ²Ä¤G¤Q¤­©¡¾÷±ñ¤uµ{¬ã°Q·|, ¹ü¤Æ, »OÆW.

61.   À¹¤l³ó, ¿à¶i²», ³\´I»Í, ´¿¦N¶©, 2008, ¡§·L²Ó½u©ñ¹q¥[¤u°Ñ¼Æ¹ï¤u¥ó«p«×¤§±´°Q¡¨, ²Ä¤G¤Q¤­©¡¾÷±ñ¤uµ{¬ã°Q·|, ¹ü¤Æ, »OÆW.

62.   À¹¤l³ó, ³Å¥É»¨, ¿à¶i²», Á¸t±L, ²ø®ï, ³\´I»Í, 2008, ¡§©ñ¹q¥[¤u²G²K¥[Â쯻Áû²É¤j¤p¤Î¿@«×¹ï·L²ÓV·¾¼Ñ¥[¤u¯S©Ê¤§±´°Q¡¨, ²Ä¤G¤Q¤­©¡¾÷±ñ¤uµ{¬ã°Q·|, ¹ü¤Æ, »OÆW.

63.   À¹¤l³ó, ¤ý¤å®p, ³Å¥É»¨, ¶¾©ÀµØ, Á¸t±L, 2008, ¡§»É໽ƦX¹q·¥¹ïSKD11¤u¨ã¿û©ñ¹qµõ¯¾¥Í¦¨¤§¼vÅT¡¨, 2008¦~¤¤°ê§÷®Æ¬ì¾Ç¾Ç·|½×¾Â½×¤å¶°, »O¥_, »OÆW.

64.   T. Y. Tai, Y. H. Fu, S. W. Shie, 2008, ¡§ The relationship between surface integrity of a V-cut slot and the addition of nickel powder into a micro-EDM dieleceric¡¨, 2008 International Symposium on Nano Science and Technology, Tainan, Taiwan.

65.   T. Y. Tai, J. S. Lai, F. C. Hsu, C. L. Tseng, 2008, ¡§ The study of workpiece thickness in micro-EDM¡¨, 2008 International Symposium on Nano Science and Technology, Tainan, Taiwan.

66.   H. T. Lee, M. L. Hsieh, F. C. Hsu, Y. Chuang, C. Liu, T. Y. Tai, Jack Y. C. Li, 2008, ¡§An investigation of electrode manufacturing and micro-hole drilling by micro-EDM¡¨, 3rd International Conference on Micromanufacturing, Illinois, USA.

67.   ³\´I»Í, À¹¤l³ó, ¿à¶i²», ´¿¦N¶©, 2008, ¡§¤u¥ó«p«×¹ï·L²Ó½u¤Á³Î¥[¤u¯S©Ê¤§¼vÅT¡¨, ²Ä¤»©¡¥þ°êºë±K»s³y¬ã°Q·|, »O«n, »OÆW.

68.   ´¿«H´¼, £¹ÅÂ@, À¹¤l³ó, ³¯ïï¥ý, ¤B¸t­Û, ¿½¤D¤¯, 2008, ¡§¼Ò¬y¤ÀªR¦b²b¤ô¾¹¶ì½¦¥~´ß¼Ò¨ã¤§À³¥Î¡¨, 2008¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW.

69.   ³\´I»Í, À¹¤l³ó, ¿à¶i²», ²ø®ï, 2008, ¡§·L²Ó½u¤Á³Î©ó¤£¦P§÷®Æ¤§¥[¤u¯S©Ê¬ã¨s¡¨, 2008¼Ò¨ã¤½·|¼Ò¨ã½×¤åµoªí·|, »O¥_, »OÆW.

70.   ³\´I»Í, À¹¤l³ó, ¿à¶i²», ²ø®ï, ³Å¥É»¨, 2008, ¡§·L²Ó½u¤Á³Îªí­±§Î»ª»P¥[¤uºë«×¤§¬ã¨s¡¨, 2008ºë±K¾÷±ñ»P»s³y§Þ³N¬ã°Q·|, ¾Á¤B, »OÆW.

71.   À¹¤l³ó, ¶¾©ÀµØ³Å¥É»¨, ¿à¶i²», ²ø®ï, ³\´I»Í, 2008, ¡§¥Hà»/»É½Æ¦X¹q·¥§í¨î©ñ¹qµõ¯¾¥Í¦¨¤§¬ã¨s¡¨, 2008ºë±K¾÷±ñ»P»s³y§Þ³N¬ã°Q·|, ¾Á¤B, »OÆW.

72.   T. Y. Tai, H. T. Lee, F. C. Hsu, 2008, ¡§Improvement of Fatigue Life by Reducing the Formation of Crack during EDM Process¡¨, 13th International Conference on Applied Mechanics and Mechanical Engineering, Cairo, Egypt.

73.   H. T. Lee , M. L. Hsieh, F. C. Hsu , Y. Chuang , C. Liu, T. Y. Tai, Jack I. CO. Lin, 2008, ¡¨The study of electrode manufacturing and micro-hole drilling by micro-EDM¡¨, 8th International Joint Workshop on Micro Fabrication, kaohsiung, Taiwan.

74.   T. Y. Tai, Y. W. Shin, S. H. Kang, 2007, ¡§The nano-scale microstructure and optical characteristic of Buprestid cuticle¡¨, 2007 International Symposium on Nano Science and Technology, Tainan, Taiwan.

75.   T. Y. Tai, N. H. Feng, Y. H. Fu, J. S. Lai, 2007, ¡§Towards minimization of the EDM cracking using molybdenum copper based composition electrodes¡¨, 2007 International Symposium on Nano Science and Technology, Tainan, Taiwan.

76.   À¹¤l³ó, ±d²Ð½÷, ¤è±oµØ, £¹ÅÂ@, ¬öªQ¤ô, 2007, ¡§·L»Ä·»²G©ó¤ú¾¦¤§¥Íª«¤O¾Ç¯S©Ê¬ã¨s¡¨, 2007¦~¥Íª«Âå¾Ç¤uµ{¬ã°Q·|, »O¤¤, »OÆW.

77.   À¹¤l³ó, §f¾Ç³Ç, ¶¾©ÀµØ, 2007, ¡§¥H¥[¤u°Ñ¼Æ§í¨îµõ¯¾¥Í¦¨ªk§ïµ½©ñ¹q¥[¤uªí­±¤§¯h³Ò¹Ø©R¡¨, ²Ä¤G¤Q¥|©¡¾÷±ñ¤uµ{¬ã°Q·|, ¤¤Ãc, »OÆW.

78.   À¹¤l³ó, ¤ý«³Åv, ±iµú²±, 2007, ¡§©ñ¹q¥[¤u°Ñ¼Æ¹ï©óÂì°ò¶W¦Xª÷ªí­±µõ¯¾¤§¬ã¨s¡¦, ²Ä¤G¤Q¥|©¡¾÷±ñ¤uµ{¬ã°Q·|, ¤¤Ãc, »OÆW.

79.   À¹¤l³ó, ¬I¶®¶², ±d²Ð½÷, 2007, ¡¨¦N¤BÂÎªí­±¤§µ²ºc»P¥ú¾Ç¯S©Ê¬ã¨s¡¨, 2007¦~¤¤°ê§÷®Æ¬ì¾Ç¾Ç·|½×¾Â½×¤å¶°, ·s¦Ë, »OÆW.

80.   À¹¤l³ó, §õ÷~µn, ¤ý«³Åv, ±iµú²±, ¶¾©ÀµØ, 2007, ¡§©ñ¹q¥[¤u°Ñ¼Æ¹ïÂì°ò¶W¦Xª÷IN738¤§µõ¯¾¬ã¨s¡¨, ²Ä¤­©¡ºë±K¾÷±ñ»P»s³y§Þ³N¬ã°Q·|, ¾Á¤B, »OÆW.

81.   T. Y. Tai, H. T. Lee, F. C. Hsu, 2007, ¡§The Influence of Working Parameters and Size Effect on Surface Roughness during EDM Process¡¨, Proceedings of 15th International Symposium for Electromaching (ISEM XV), Pittsburg, USA.

82.   F. C. Hsu, H. T. Lee, T. Y. Tai, Y. F. Lin and F. Klocke, 2007, ¡§The Feasibility Study of Micro-EDM Hole-Drilling Method for Measuring Residual Stress¡¨, Proceedings of 15th International Symposium for Electromaching (ISEM XV), Pittsburg, USA.

83.   À¹¤l³ó, §õ÷~µn, §f¾Ç³Ç, 2006, ¡§©ñ¹q¥[¤u¤§ªí­±µõ¯¾±Ó·P©Ê¬ã¨s¡¨, »OÆWª÷Äݼö³B²z¾Ç·|¤E¤Q¤­¦~½×¤å¬ã°Q·|, »O«n, »OÆW.

84.   À¹¤l³ó, ±d²Ð½÷, ¤è±oµØ, £¹ÅÂ@, ¬öªQ¤ô, 2006, ·L¼v§Þ³NÀ³¥Î©ó¥é½ºÁl·Lµ²ºc»s§@»P¥ú¾Ç¤ÀªR, ²Ä¤Q©¡©`¦Ì¤uµ{º[·L¨t²Î§Þ³N¬ã°Q·|, ·s¦Ë, »OÆW.

85.   À¹¤l³ó, §õ÷~µn, ¤ý«³Åv, 2006, ¡§SKS93©ñ¹qµõ¯¾»P¥[¤u°Ñ¼ÆÃö«Y¤§¬ã¨s¡¨, ²Ä¤G¤Q¤T©¡¾÷±ñ¤uµ{¬ã°Q·|, »O«n, »OÆW.

86.   T. Y. Tai, H. T. Lee, F. C. Hsu, 2006, ¡§The analysis of the craters formed during micro-EDM process¡¨, International Workshop on Nano-Structured Materials and Magnetics, Taipei, Taiwan.

87.   F. C. Hsu, H. T. Lee, T. Y. Tai, D. Thomaidis, G. Antonoglou, D. Lung, F. Klocke, 2006, ¡§The improvement of EDM Hole-Drilling Method for measuring residual stress by the Micro-EDM technology¡¨, 1st International Conference on Micromanufacturing, Illinois, USA.

88.   À¹¤l³ó, §õ÷~µn, ³\´I»Í, T. Masuzawa, 2005, ¡§À³¥Î·L²Ó©ñ¹q¥[¤uªk¦b¼ö§@¤u¨ã­èÆp·L¤p²`¤Õ¤§±´°Q¡¨, ²Ä¤G¤Q¤G©¡¾÷±ñ¤uµ{¬ã°Q·|.

89.   ³\´I»Í, §õ÷~µn, À¹¤l³ó, D. Thomaidis, G. Antonoglou, D. Lung, F. Klocke, 2004, ¡§À³¥Î·L©ñ¹q¥[¤u§Þ³N§ï¨}©ñ¹q¥[¤uÆp¤Õªk©ó´Ý¯dÀ³¤O¶q´ú¤§µû¦ô¡¨, ²Ä¤G¤Q¤@©¡¾÷±ñ¤uµ{¬ã°Q·|.

90.   À¹¤l³ó, §õ÷~µn, ³\´I»Í, ³¯¬f°¶, 2004, ¡§©ñ¹q¥[¤u°Ñ¼Æ»P¹q·¥¤Ø¤o®ÄÀ³¹ïªí­±²ÊÁW«×¤§¼vÅT¡¨, ²Ä¤G¤Q¤@©¡¾÷±ñ¤uµ{¬ã°Q·|.

91.   T. Y. Tai, H. T. Lee, F. C. Hsu, 2004, ¡§The analysis of the surface integrity in micro-EDM Process¡¨, 2004 International Symposium on Nano Science and Technology, Tainan, Taiwan.

92.   §õ÷~µn, À¹¤l³ó, W. P. Rehbach, R. Harscheidt, 2004, ¡§¥H±½ºË¦¡¹q¤lÅã·LÃè¡B¹p®g¦@µJ±½ºËÅã·LÃè»P¥Õ¥ú¤z¯A»öÀË´ú©ñ¹q¥[¤uÆp¤Õ¤§¤ñ¸û¡§, ¤¤µØ¥Á°ê²Ä¤K©¡¯}Ãa¬ì¾Ç¬ã°Q·|.

93.   H. T. Lee, W. P. Rehbach, F. C. Hsu, T. Y. Tai, Edward Hsu, 2004, ¡§The Study of EDM Hole-Drilling Method for Measuring Residual Stress in SKD11 Tool Steel¡¨, Proceedings of 14th International Symposium for Electromaching (ISEM), Edinburgh, England.

94.   H. T. Lee, T. Y. Tai, W. P. Rehbach, R. Harscheidt, 2003, ¡§Darstellung und Vermessung von mittels Funkenerosion erzeugten Bohrungen mit Weißlicht-Interferometrie, konfokaler Lasermikroskopie und Stereo- Rasterelektronenmikroskopie¡¨, Vortragstexte der 37. Metallographie-Tagung, pp. 187-191.

¡@§Þ³N³ø§i

1.      À¹¤l³ó (201708), ¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{­pµe-¡uºë±K¥[¤u»s³y¤H¤~°ö°V­pµe¡vµ²®×³ø§i

2.      À¹¤l³ó(2016,10) ´¼¯à¤Æ¨T¨®¹s²Õ¥ó»s³yÃì¾ã¦X»²¾É´£¤É­pµeµ²®×³ø§i

3.      À¹¤l³ó(2015,08), 104¾Ç¦~«×¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{º[¦@³q®Ö¤ß¾¯à½Òµ{±M¯Z-ºë±K¥[¤u»s³y¤H¤~°ö°V­pµeµ²®×³ø§i

4.      À¹¤l³ó(2015,06), «Ø¥ß¹p®gÀJ¨èÜg¦Xª÷ªí­±§½³¡µo¦â³B²z¤§°Ñ¼Æ¸ê®Æ®w¦¨ªG³ø§i

5.      À¹¤l³ó(2014,05), ©ñ¹q¥[¤u¾÷¾÷¥x¼öÅܧΤÀªR¦¨ªG³ø§i

6.      À¹¤l³ó,¹ù§Ó¤É(2011.02), °ê¬ì·|¤j±M¾Ç¥Í°Ñ»P±MÃD¬ã¨s­pµe-¡u¸}½ñ¨®¯à·½Âà´«¤§À³¥Î(99-2815-C-218-049-E)¡v¦¨ªG³ø§i

7.      À¹¤l³ó(2009.11), ¾Ç¬É¨ó§U¤¤¤p¥ø·~¬ì§ÞÃöÃh­pµe, ¡u¯S®í¿û¼Ò¨ã¥[¤u§Þ³N²~ÀV¿Ô¸ß»P¸Ñ¨M¤§¤è®×¡vµ²®×³ø§i¡C

8.      À¹¤l³ó(2009.09), ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß²£¾Ç¦X§@®×, ¡u¬ï½u¾÷ºc¤ÀªR»P»s¹Ï¡v´Á¥½³ø§i¡C

9.      À¹¤l³ó¡B¼B©ø©¾¡B§õ­s¼z¡B§d©Ó¶©(2009.05)¡A±Ð¨|³¡ÅU°Ý«Ç®ü¬v±Ð¨|¥ý¾É«¬­pµe, ªë¥Ø³½ªº¬G¶m¡X°ê¤p±Ð§÷¡C

10.   À¹¤l³ó¡B¼B©ø©¾¡B§õ­s¼z¡B§d©Ó¶©(2009.05)¡A±Ð¨|³¡ÅU°Ý«Ç®ü¬v±Ð¨|¥ý¾É«¬­pµe, ªë¥Ø³½ªº¬G¶m¡X°ê¤¤±Ð§÷¡C

11.   ³¯¥¿¨k,¤B§Ó§»,À¹¤l³ó,Ĭ¶¶µo,¶À¤å§»,´¿­Û±R(2008.09), °]¹Îªk¤Hºë±K¾÷±ñ¬ã¨sµo®i¤¤¤ß©e°U¬ã¨s®×¡X¡u¾÷±ñ¹s²Õ¥ó¼Ò²Õ¤Æªº§Þ³N¤ÀªR¬ã¨s¡v´Á¥½³ø§i¡C

12.   À¹¤l³ó¡B³¯«a§»(2008.03), °ê¬ì·|¤j±M¾Ç¥Í°Ñ»P±MÃD¬ã¨s­pµe¡X¡u»É¥d¤Øªº­×´_»P¬ã¨s(97-2815-C-218-019-E)¡v¦¨ªG³ø§i

13.   À¹¤l³ó, ´¿«H´¼, Ĭ¶¶µo(2007.11), «~°í¤u·~ªÑ¥÷¦³­­¤½¥q²£¾Ç¦X§@®×, ¡u²B®ð»s³y¾÷²B¥i¦æ©Ê³W¹º¤§¬ã¨s¡v´Á¥½³ø§i

14.   ´¿«H´¼, À¹¤l³ó (2009.10), «~°í¤u·~ªÑ¥÷¦³­­¤½¥q²£¾Ç¦X§@®×, ¡u¦h¥\¯à²b¤ô¹LÂo¾¹¤§¬ã¨s¡v´Á¥½³ø§i

¡@±M§Q

  1. 2017/08/01, À¹¤l³ó¡B±iÞ³¥Á¡A¥i½Õ®ðÀ£ªý¤O¦¡°·ÃM¾÷, µo©ú±M§Q¸¹ÃҮѸ¹½X¡GI593439
  2. 2016/06/1,1À¹¤l³ó¡B¤ý­§²[¡B§º«aÞ³¡B¹ù¬f¿«¡B¼B¨|»¨¡B«¸²Ð¶v¡AµL¬q²ü­«Åܤư·¨­¨®, ·s«¬±M§QÃҮѸ¹½X¡GM523476
  3. 2015/06/01, À¹¤l³ó¡B³¢¥¿¦t¡A¥i½Õ¾ã¤ôÀ£ªý¤O¦¡¥Y½ü°jÂ੹´_¦¡¤UªÏÅé¾A¯à¾¹§÷, µo©ú±M§QÃҮѸ¹½X¡GI486190,
  4. 2015/04/28, Tai et al., Water Resistance Lower Body Reciprocating Exerciser, ¬ü°êµo©ú±M§Q, US9017233B2
  5. 2015/04/28, Tai et al., Water Resistance Upper Body Reciprocating Exerciser, ¬ü°êµo©ú±M§Q, US9017234B2
  6. 2015/02/01, À¹¤l³ó¡B³¢¥¿¦t¡A¥H¤ôÀ£¬°ªý¤O¤§¥Y½ü°jÂ੹´_¦¡¤WªÏ¹B°Ê¸Ë¸m, µo©ú±M§QÃҮѸ¹½X¡GI471157
  7. 2013/07/11, À¹¤l³ó¡B±iÞ³¥Á¡Aªý¤O¦¡°·ÃM¾÷, ·s«¬±M§QÃҮѸ¹½X¡GM456831

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2017/05~2017/10      ¨T¾÷¨®¹s²Õ¥ó´¼¯à»ù­ÈÃì»Pºë±K¼Ò¨ã¾ã¦X»²¾É´£¤É­pµe, ­pµe¤À¶µ¥D«ù¤H, ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(72,000)

2016/07~2017/08      105¾Ç¦~«×¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{­pµe-ºë±K¥[¤u»s³y¤H¤~°ö°V­pµe, ­pµe¥D«ù¤H, ³Ò°Ê³¡(750,000)

2016/05~2016/10      ´¼¯à¤Æ¨T¨®¹s²Õ¥ó»s³yÃì¾ã¦X»²¾É´£¤É­pµe, ­pµe¥D«ù¤H, ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(192,000)

2015/08~2016/07      «Øºc°ªÄ֪̹B°Ê¤ä«ù¨t²Î¤§¬ã¨s(II)¡Ð¨ÌÂà³t¦Û½Õªý力¦¡°ªÄ֪̤½¶éÅé, ­pµe¥D«ù¤H,¬ì§Þ³¡(656,000), MOST 104-2410-H-218 -014

2015/07~2016/08      104¾Ç¦~«×¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{º[¦@³q®Ö¤ß¾¯à½Òµ{±M¯Z-ºë±K¥[¤u»s³y¤H¤~°ö°V­pµe, ­pµe¥D«ù¤H, ³Ò°Ê³¡(750,000).

2015/05~2015/10      ¨T¾÷¨®¹q¾¹¹s²Õ¥óº[ºë±K¾÷±ñ¸ó»â°ì§Þ³N»²¾É´£¤É­pµe, ­pµe¤À¶µ¥D«ù¤H, ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(144,000)

2015/08~2016/07      «Øºc°ªÄ֪̹B°Ê¤ä«ù¨t²Î¤§¬ã¨s¡Ð¨ÌÂà³t¦Û½Õªý¤O¦¡°ªÄ֪̤½¶éÅé¾A¯à¾¹§÷«Ø¸m¶}µo, ­pµe¥D«ù¤H,¬ì§Þ³¡(633,000), MOST 103-2410-H-218 -021

2014/07~2015/08      104¦~«×¸É§U¤j±M®Õ°|¿ì²z´N·~¾Çµ{­pµe-ºë±K¥[¤u»s³y¤H¤~°ö°V­pµe, ­pµe¥D«ù¤H, ³Ò°Ê³¡(750,000)

2014/07~2015/06      «Ø¥ß¹p®gÀJ¨èÜg¦Xª÷ªí­±§½³¡µo¦â³B²z¤§°Ñ¼Æ¸ê®Æ®w, ­pµe¥D«ù¤H, §Ó¿ûª÷Äݪѥ÷¦³­­¤½¥q(65,000)

2014/05~2014/10      ¨T¾÷¨®¹s²Õ¥ó¼t¸ó»â°ì§Þ³N»²¾É´£¤É­pµe, ­pµe¤À¶µ¥D«ù¤H, ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(72,000)

2014/01~2015/05      ©ñ¹q¥[¤u¾÷¾÷¥x¼öÅܧΤÀªR, ­pµe¥D«ù¤H, »õÂ`¥ø·~ªÑ¥÷¦³­­¤½¥q(50,000)

2014/08~2015/07      ¥i½Õ¾ãªý¤O¦¡°ªÄ֪̤½¶éÅé¾A¯à¾¹§÷«Ø¸m¶}µo, ­pµe¥D«ù¤H,¬ì§Þ³¡(782,000), MOST 102-2410-H-218 -024

2012/01~2013/06      ¶W°ª´`Àô¦h¼Ò¥Þ¼ä²b²£«~Turn Key¹q°Êºë±K®g¥X¦¨«¬¨t²Î¶}µo, ­pµe¥D«ù¤H,¥þ¥ßµo¾÷±ñ¼tªÑ¥÷¦³­­¤½¥q(4,400,000)

2012/05~2012/10      «n¥xÆWºë±K¾÷±ñ²£·~»E¸¨¦Û°Ê¤Æ»P¸ê³q§Þ³N¾É¤J»²¾É±M®×, ­pµe¥D«ù¤H, ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(200,000)

2012/05~2012/10      ºë±K°ª¶¥¼Ò¨ã¥[­È¤Æ¤§´£¤É, ­pµe¥D«ù¤H, §Q·¸Â×¹ê·~¦³­­¤½¥q(72,000)

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«Øºc°ªÄ֪̦b¦a¦Ñ¤Æ¹B°Ê«P¶i¼Ò¦¡¤§¬ã¨s¡Ð°ªÄ֪̤½¶éÅé¾A¯à¾¹§÷¨t²Î«Ø¸m¶}µo,­pµe¥D«ù¤H,°ê¬ì·|(1,241,000), NSC 100-2410-H-218 -018 -MY2

2011/08~2012/07

¬ì´¶¬¡°Ê¡G¤j¦ÛµM»P¹B°Ê¤¤ªº¥é¥Í¬ì¾Ç, ¦@¦P¥D«ù¤H, °ê¬ì·|(400,000), NSC 100-2515-S-154 -001

2011/06~2011/12

¦h´¹Æp©ñ¹q¥[¤u¯S©Ê¬ã¨s, ­pµe¥D«ù¤H, °·°¥¾÷¹q¤u·~ªÑ¥÷¦³­­¤½¥q(80,000)

2011/01~2011/07

±q¥ÍºA, ¯«¸g¥Í²z¤Î©`¦Ì¬ì¾Ç¨¤«×±´°Q³DÃþÅì¤ù¦h¼Ë¤Æªº§ÎºA»P¥\¯à,¦@¦P¥D«ù¤H,°ê¬ì·|(600,000), NSC 100-2621-B-020 -001

2010/11~2011/03

PCD©ñ¹q¥[¤u°Ñ¼Æ»P²ÊÁW«×¥ú¾Ç¶q´ú, ­pµe¥D«ù¤H, ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(80,000)

2010/10~2011/01

¯S®íª÷ÄÝ¥i¼¸Àô·Lµ²ºc»P¾÷±ñ©Ê½è¤ÀªR, ­pµe¥D«ù¤H, »ñ°O°ê»Ú¾÷±ñªÑ¥÷¦³­­¤½¥q(100,000)

2010/08~2013/07

°ªºë«×·L«¬CNCºî¦X¥[¤u¾÷»P¤Tºû¶q´ú¨t²Î¤§¬ãµo, ¦@¦P¥D«ù¤H, °ê¬ì·|(15,023,750), NSC 99-2632-E-218-001-MY3

2010/07~2011/04

¦h¥\¯à¾ã¦X«¬¦Û¦æ¨®°t¥ó¶}µo,¦@¦P¥D«ù¤H, ¿«¦¿°ê»ÚªÑ¥÷¦³­­¤½¥q(400,000)

2010/07~2010/12

Âê¨ã¨Ï¥Î¹Ø©R»P«~½è´£¤É¤§¶EÂ_, ­pµe¥D«ù¤H, ¼eÂפu·~ªÑ¥÷¦³­­¤½¥q(72,000)

2010/06~2011/05

¬ì´¶¬¡°Ê¡GÀ³¥Î¿Ä¤J¦¡±Ð¾Ç´£¤É°¾»·¦a°Ï¾Çµ£®ü¬v¥ÍºAª¾¯à, ¦@¦P¥D«ù¤H, °ê¬ì·|(1,320,000), NSC 99-2515-S-329 -001

2010/01~2010/12

ÃöÃh¨a¥Á¬ì´¶¬¡°Ê-¤j¦ÛµM¸Ì¶ø§®ªº¥é¥Í¬ì¾Ç, ­pµe¥D«ù¤H, °ê¬ì·|(400,000), NSC 99-2515-S-218-002

2009/08~ 2011/07

¬ì´¶¬¡°Ê:¯è¦V®ü¬vªºOP¦|²î, ­pµe¥D«ù¤H, °ê¬ì·|(1,640,000), NSC-98-2515-S-218-002-MY2

2009/07~2010/06

¬ì´¶¬¡°Ê:®ü©¤¥Íª«»P¬ì§Þªº¹ï¸Ü, ¦@¦P¥D«ù¤H, °ê¬ì·|(907,000), NSC 98-2515-S-022 -001

2009/06~2009/11

¯S®í¿û¼Ò¨ã¥[¤u§Þ³N²~ÀV¿Ô¸ß»P¸Ñ¨M¤§¤è®×, ­pµe¥D«ù¤H, ¤T°º¤u·~ªÑ¥÷¦³­­¤½¥q(72,000)

2009/05~ 2009/09

¬ï½u¾÷ºc¤ÀªR»P»s¹Ï, ­pµe¥D«ù¤H, ª÷Äݤu·~¬ã¨sµo®i¤¤¤ß(50,000)

2009/04~ 2009/12

²Ä¤G¥N¤ô²£¾i´Þª¾ÃѸgÀÙ²£¾Ç¥­¥xII, ¤l­pµe9¬¡½¼¥Õ°Ê³c½æ¾÷¥ý¶i¾÷±ñµ²ºcªº³]­p»P»s§@, ­pµe¥D«ù¤H, ±Ð¨|³¡(280,000)

2008/08~ 2009/07

¥H·L²Ó©ñ¹q¥[¤u»s³y¨ãV·¾¼Ñ°}¦Cºu½ü©ó±²¨ú¦¡¸WÃ轤»s³y¤§¬ã¨s, ­pµe¥D«ù¤H,°ê¬ì·|(772,000), NSC-97-2221-E-218-008

2008/06~ 2009/02

®ü¬v¬ì¾Ç¤Î®ü¬v¥Íª«¬ì¾Ç±Ð§÷µo®i­pµe, ­pµe¥D«ù¤H, ±Ð¨|³¡(678,500), MOE-097-05-05-2-23-5-19

2008/04~ 2008/09

¾÷±ñ¹s²Õ¥ó¼Ò²Õ¤Æªº§Þ³N¤ÀªR¬ã¨s, ¦@¦P¥D«ù¤H, °]¹Îªk¤Hºë±K¾÷±ñ¬ã¨sµo®i¤¤¤ß(300,000)

2008/01~ 2008/12

¤Ó¶§¯à/¿U®Æ¹q¦À¨®§÷®Æ¬ãµo¡B¨t²Î¾ã¦Xº[¤H¤~°ö¨|­pµe-¤l­pµe1¿U®Æ¹q¦À§÷®Æ¤§¬ãµo, ±Ð¨|³¡

2007/04~ 2007/11

²B®ð»s³y¾÷¥i¦æ©Ê³W¹º¤§¬ã¨s, ­pµe¥D«ù¤H, «~°í¤u·~ªÑ¥÷¦³­­¤½¥q(200,000)

2006/08~ 2007/07

¥Hà»/»É½Æ¦X¹q·¥§í¨î©ñ¹qµõ¯¾¥Í¦¨¤§¬ã¨s, ­pµe¥D«ù¤H, °ê¬ì·|(665,000), NSC-95-2221-E-218-016

2005/08~ 2006/07

¥H¥[¤u°Ñ¼Æ§í¨îµõ¯¾¥Í¦¨ªk§ïµ½©ñ¹q¥[¤uªí­±¤§¯h³Ò¹Ø©R, ­pµe¥D«ù¤H, °ê¬ì·|(387,000), NSC 94-2212-E-218-005

2004/10~ 2005/07

·L²Ó©ñ¹q¥[¤u©ñ¹q²L§|¤§¤ÀªR, ­pµe¥D«ù¤H, °ê¬ì·|(305,800), NSC 93-2212-E-218-011

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2018/07~2018/07      ¦¨¥\¤j¾Ç¾÷±ñ¨t, ºÓ¤h¾Ç¦ì¦Ò¸Õ©e­û

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2017/12~2017/12      ¤¤°ê¾÷±ñ¤uµ{¾Ç·|²Ä34©¡¥þ°ê¾Ç³N¬ã°Q·|, ¤À²Õ¥D«ù¤H

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2017/07~2017/07      ¦¨¥\¤j¾Ç¾÷±ñ¨t, ºÓ¤h¾Ç¦ì¦Ò¸Õ©e­û

2016/08~2017/07      105¾Ç¦~«×(¨t)°ò¦½Òµ{»²¾É©e­û·|

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2015/12~2015/12      ¤¤°ê¾÷±ñ¤uµ{¾Ç·|²Ä32©¡¥þ°ê¾Ç³N¬ã°Q·|, ¤À²Õ¥D«ù¤H

2011/10~2011/12

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2010/12~2010/12

¤¤°ê¾÷±ñ¤uµ{¾Ç·|²Ä27©¡¥þ°ê¾Ç³N¬ã°Q·|, ¤À²Õ¥D«ù¤H & ½×¤å¼f¬d©e­û

2010/08~2010/12

2010 International Conference on Manufacturing and Engineering Systems, committee member

2010/08~2010/08

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2010/08~¨´¤µ

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2010/02~¨´¤µ

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2010/01~2010/01

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2010/01~2010/01

16th International Symposium for Electromaching (ISEM XVI), paper reviewer

2009/11~2009/11

¤¤°ê¾÷±ñ¤uµ{¾Ç·|²Ä26©¡¥þ°ê¾Ç³N¬ã°Q·|, ¤À²Õ¥D«ù¤H& ½×¤å¼f¬d©e­û

2009/10~2009/12

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2009/08~¨´¤µ

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2009/06~2009/06

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2009/05~2009/05

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2009/05~2009/05

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2009/04~2009/06

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2009/01~2009/01

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2009/01~¨´¤µ

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2008/11~2008/11

¦æ¬F°|³Ò¤u©e­û·|¾·~°V½m§½¡uÆ[¥ú²£·~¤H¤~°ö°V®¶¿³­pµe¡vÁ¿®v

2008/10~2008/10

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2008/07~2008/07

¦¨¥\¤j¾Ç¾÷±ñ¨t, ºÓ¤h¾Ç¦ì¦Ò¸Õ©e­û

2008/07~¨´¤µ

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2008/06~2008/06

Journal of the Chinese Institute of Engineers, paper reviewer

2007/10~2007/10

2007 International Conference on Advanced Mechatronics, paper reviewer

2007/08~2007/08

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2007/07~2007/07

¦¨¥\¤j¾Ç¾÷±ñ¨t, ºÓ¤h¾Ç¦ì¦Ò¸Õ©e­û

2007/04~2007/04

15th International Symposium for Electromaching (ISEM XV), session chair

2007/03~2007/03

°ê¥ß¥x«n¤j¾Ç¨t²Î¤uµ{¬ã¨s©ÒºÓ¤h¯Z»s³y¾Ç©RÃD©e­û

2006/10~2006/10

2006 International Manufacturing Leaders Forum½×¤å¼f¬d©e­û

2006/07~2007/07

¦¨¥\¤j¾Ç¾÷±ñ¨t, ºÓ¤h¾Ç¦ì¦Ò¸Õ©e­û

2005/11~2005/11

²Ä¤E©¡©`¦Ì¤uµ{º[·L¨t²Î§Þ³N¬ã°Q·|, ¤À²Õ¥D«ù¤H & ½×¤å¼f¬d©e­û

2005/07~2005/07

¦¨¥\¤j¾Ç¾÷±ñ¨t, ºÓ¤h¾Ç¦ì¦Ò¸Õ©e­û

2004/07~2004/07

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